SLVSHI9A March   2025  – September 2025 TPS7H5020-SEP , TPS7H5020-SP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Quality Conformance Inspection
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage (VIN) and VLDO
      2. 7.3.2  Driver Input Voltage (PVIN)
      3. 7.3.3  Start-Up
      4. 7.3.4  Enable and Undervoltage Lockout (UVLO)
      5. 7.3.5  Voltage Reference
      6. 7.3.6  Error Amplifier
      7. 7.3.7  Output Voltage Programming
      8. 7.3.8  Soft Start (SS)
      9. 7.3.9  Switching Frequency and External Synchronization
        1. 7.3.9.1 Internal Oscillator Mode
        2. 7.3.9.2 External Synchronization Mode
          1. 7.3.9.2.1 External Synchronization with TPS7H5021
      10. 7.3.10 Duty Cycle Limit
      11. 7.3.11 Minimum On-Time and Off-Time
      12. 7.3.12 Pulse Skipping
      13. 7.3.13 Leading Edge Blank Time
      14. 7.3.14 Current Sense and PWM Generation (CS_ILIM)
      15. 7.3.15 Gate Driver Output
      16. 7.3.16 Unpowered Voltage Clamp
      17. 7.3.17 Sourcing Driver Return (OUTH_REF)
      18. 7.3.18 Slope Compensation (RSC)
      19. 7.3.19 Frequency Compensation
      20. 7.3.20 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency
        2. 8.2.2.2  Output Voltage Programming Resistor Selection
        3. 8.2.2.3  Driver PVIN Configuration
        4. 8.2.2.4  Soft-Start Capacitor Selection
        5. 8.2.2.5  Transformer Design
        6. 8.2.2.6  Primary Power Switch Selection
        7. 8.2.2.7  Output Diode Selection
        8. 8.2.2.8  RCD Clamp
        9. 8.2.2.9  Output Capacitance Selection
        10. 8.2.2.10 Current Sense Resistor
        11. 8.2.2.11 Frequency Compensation Component Selection
      3. 8.2.3 Application Curves
      4. 8.2.4 Boost Converter
      5. 8.2.5 Feedback Isolation Using ISOS510
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TP7H502x UNIT
HTSSOP
24 PINS
RθJA Junction-to-ambient thermal resistance 26.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
RθJB Junction-to-board thermal resistance 7.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.0 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 7.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.