SLVSGJ5 April   2022 TPSM63604

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
    8. 7.8 Typical Characteristics (VIN = 12 V)
    9. 7.9 Typical Characteristics (VIN = 24 V)
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN1, VIN2)
      2. 8.3.2  Adjustable Output Voltage (FB)
      3. 8.3.3  Input Capacitors
      4. 8.3.4  Output Capacitors
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Precision Enable and Input Voltage UVLO (EN/SYNC)
      7. 8.3.7  Frequency Synchronization (EN/SYNC)
      8. 8.3.8  Power Good Monitor (PG)
      9. 8.3.9  Adjustable Switch-Node Slew Rate (RBOOT, CBOOT)
      10. 8.3.10 Bias Supply Regulator (VCC, VLDOIN)
      11. 8.3.11 Overcurrent Protection (OCP)
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – High-Efficiency 4-A Synchronous Buck Regulator for Industrial Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Output Voltage Setpoint
          3. 9.2.1.2.3 Switching Frequency Selection
          4. 9.2.1.2.4 Input Capacitor Selection
          5. 9.2.1.2.5 Output Capacitor Selection
          6. 9.2.1.2.6 Other Connections
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – Inverting Buck-Boost Regulator with Negative Output Voltage
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Output Voltage Setpoint
          2. 9.2.2.2.2 IBB Maximum Output Current
          3. 9.2.2.2.3 Switching Frequency Selection
          4. 9.2.2.2.4 Input Capacitor Selection
          5. 9.2.2.2.5 Output Capacitor Selection
          6. 9.2.2.2.6 Other Considerations
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Design and Layout
    2. 11.2 Layout Example
      1. 11.2.1 Package Specifications
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Other Considerations

Short RBOOT to CBOOT and connect VLDOIN to the power stage GND terminal (corresponding to VOUT1, VOUT2 of the module) for best efficiency.

The right-half-plane zero of an IBB topology is at its lowest freqeuncy at minimum input voltage and highest load current. Using the TPSM63604 quickstart calculator, select the output capacitance to set that the loop crossover freqeuncy at less than one third of the lowest right-half-plane zero frequency for a given application.