SLUSEF1B September   2021  – November 2022 TPSM82864A , TPSM82866A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Forced PWM Mode
      3. 8.3.3 Optimized Transient Performance from PWM to PSM Operation
      4. 8.3.4 Low Dropout Operation (100% Duty Cycle)
      5. 8.3.5 Soft Start
      6. 8.3.6 Switch Current Limit and HICCUP Short-Circuit Protection
      7. 8.3.7 Undervoltage Lockout
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable (EN)
      2. 8.4.2 Output Discharge
      3. 8.4.3 Power Good (PG)
      4. 8.4.4 Output Voltage and Mode Selection (VSET/MODE)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting The Output Voltage
        2. 9.2.2.2 Input and Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Design Requirements

For this design example, use Table 9-1 as the input parameters.

Table 9-1 Design Parameters
DESIGN PARAMETEREXAMPLE VALUE
Input voltage2.4 V to 5.5 V
Output voltage1.2 V
Maximum output current6 A

Table 9-2 lists the components used for the example.

Table 9-2 List of Components
REFERENCEDESCRIPTIONMANUFACTURER(1)
C122 µF, Ceramic capacitor, 6.3 V, X7R, size 0805, GRM21BZ70J226ME44Murata

C2

47 µF, Ceramic capacitor, 6.3 V, X6S, size 0805, JMK212BC6476MG-T

Taiyo Yuden

R1Depending on the output voltage, Chip resistor, 1/16 W, 1%Std
R2100 kΩ, Chip resistor, 1/16 W, 1%Std
R3100 kΩ, Chip resistor, 1/16 W, 1%Std
(1) See the Third-party Products disclaimer.