SLVSG68 November   2022 TPSM82901

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Mode Selection and Device Configuration (MODE/S-CONF)
      2. 7.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 7.3.3 Setable VO Operation (VSET and Internal Voltage Divider)
      4. 7.3.4 Soft Start/Tracking (SS/TR)
      5. 7.3.5 Smart Enable with Precise Threshold
      6. 7.3.6 Power Good (PG)
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Current Limit And Short Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 AEE (Automatic Efficiency Enhancement)
      3. 7.4.3 Power Save Mode Operation (Auto PFM/PWM)
      4. 7.4.4 100% Duty-Cycle Operation
      5. 7.4.5 Output Discharge Function
      6. 7.4.6 Starting into a Pre-Biased Load
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application with Adjustable Output Voltage
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Programming the Output Voltage
        3. 8.2.2.3 Capacitor Selection
          1. 8.2.2.3.1 Output Capacitor
          2. 8.2.2.3.2 Input Capacitor
          3. 8.2.2.3.3 Soft-Start Capacitor
        4. 8.2.2.4 Tracking Function
      3. 8.2.3 Application Curves
    3. 8.3 Typical Application with Setable VO Using VSET
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Thermal Considerations
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPSM8290x UNIT
uSIP11-Pin
JEDEC PCB TPSM8290xEVM-188
RθJA Junction-to-ambient thermal resistance                       58.2                            48.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance                       34.5                     °C/W
RθJB Junction-to-board thermal resistance                       26.9                                   °C/W
ΨJT Junction-to-top characterization parameter                        0.3                           0.8            °C/W
ΨJB Junction-to-board characterization parameter                        26.6                             27.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance                        26.0         °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.