SLOU186G August   2006  – May 2017 TRF7960 , TRF7961

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Power Supplies
      1. 6.2.1 Negative Supply Connections
      2. 6.2.2 Digital I/O Interface
      3. 6.2.3 Supply Regulator Configuration
      4. 6.2.4 Power Modes
      5. 6.2.5 Timing Diagrams
    3. 6.3 Receiver - Analog Section
      1. 6.3.1 Received Signal Strength Indicator (RSSI)
      2. 6.3.2 Receiver - Digital Section
      3. 6.3.3 Transmitter
        1. 6.3.3.1 Transmitter - Analog Section
        2. 6.3.3.2 Transmitter - Digital Section
      4. 6.3.4 Direct Mode
      5. 6.3.5 Register Preset
    4. 6.4 Register Descriptions
      1. 6.4.1 Control Registers - Main Configuration Registers
      2. 6.4.2 Control Registers - Sublevel Configuration Registers
      3. 6.4.3 Status Registers
      4. 6.4.4 FIFO Control Registers
    5. 6.5 Direct Commands From MCU to Reader
      1. 6.5.1  Command Codes
      2. 6.5.2  Reset FIFO
      3. 6.5.3  Transmission With CRC
      4. 6.5.4  Transmission Without CRC
      5. 6.5.5  Delayed Transmission With CRC
      6. 6.5.6  Delayed Transmission Without CRC
      7. 6.5.7  Transmit Next Time Slot
      8. 6.5.8  Receiver Gain Adjust
      9. 6.5.9  Test External RF (RSSI at RX Input With TX Off)
      10. 6.5.10 Test Internal RF (RSSI at RX Input With TX On)
      11. 6.5.11 Block Receiver
      12. 6.5.12 Enable Receiver
    6. 6.6 Reader Communication Interface
      1. 6.6.1 Introduction
    7. 6.7 Parallel Interface Communication
      1. 6.7.1 Receive
      2. 6.7.2 Transmit
    8. 6.8 Serial Interface Communication
      1. 6.8.1 SPI Without SS* (Slave Select) Pin
      2. 6.8.2 SPI With SS* (Slave Select) Pin
        1. 6.8.2.1 FIFO Operation
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Schematics
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Revision History

Changes from August 12, 2010 to May 18, 2017

  • Removed "and AGC" from "Selectable Receiver Gain" in Section 1.1, Features Go
  • Updated list of applicationsGo
  • Changed contents of Section 1.3, DescriptionGo
  • Added Device Information tableGo
  • Added Section 1.4, Typical ApplicationGo
  • Added Section 3, Device Comparison, and moved Table 3-1 to itGo
  • Added Section 3.1, Related Products Go
  • Changed the title of Section 4 from Physical Characteristics to Terminal Configuration and FunctionsGo
  • Removed former Section 3.2, Packaging and Ordering Information (see Section 9, Mechanical, Packaging, and Orderable Information)Go
  • Updated note (1) on Section 5.1, Absolute Maximum Ratings, to standard wordingGo
  • Moved ESD ratings from Absolute Maximum Ratings to Section 5.2, ESD Ratings; changed ratings from positive voltages only to positive and negative; added notes for HBM and CDMGo
  • Changed format of MIN, TYP, and MAX columns in Section 5.4, Electrical CharacteristicsGo
  • Added the fD_CLKmax parameter in Section 5.4, Electrical Characteristics Go
  • Changed title of and moved Section 5.5, Thermal Resistance CharacteristicsGo
  • Moved contents of Section 6.1, Overview from former Section 2Go
  • Removed a paragraph that began "The second receiver gain stage and digitizer stage..." in Section 6.3, Receiver – Analog SectionGo
  • Added the last sentence to the paragraph that begins "The start of the receive operation (successfully received SOF)..." in Section 6.3.2, Receiver – Digital Section Go
  • Added "and ISO/IEC 15693" to the first sentence of the paragraph that begins "The framing section also supports bit-collision detection..." in Section 6.3.2, Receiver – Digital SectionGo
  • Changed B2 to Reserved in Table 6-11, Chip Status Control Register (Address = 00h) Go
  • Changed B1 and B0 to Reserved in Table 6-22, RX Special Setting Register (Address = 0Ah) Go
  • Added the last sentence to the paragraph that begins "The serial communications work in the same manner..." in Section 6.8, Serial Interface CommunicationGo
  • Removed former section External Power Amplifier ApplicationGo
  • Added Section 7, Applications, Implementation, and Layout, and moved the application schematics to itGo
  • Added Section 8, Device and Documentation SupportGo
  • Added Section 9, Mechanical, Packaging, and Orderable InformationGo