SLOU186G August   2006  – May 2017 TRF7960 , TRF7961

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Power Supplies
      1. 6.2.1 Negative Supply Connections
      2. 6.2.2 Digital I/O Interface
      3. 6.2.3 Supply Regulator Configuration
      4. 6.2.4 Power Modes
      5. 6.2.5 Timing Diagrams
    3. 6.3 Receiver - Analog Section
      1. 6.3.1 Received Signal Strength Indicator (RSSI)
      2. 6.3.2 Receiver - Digital Section
      3. 6.3.3 Transmitter
        1. 6.3.3.1 Transmitter - Analog Section
        2. 6.3.3.2 Transmitter - Digital Section
      4. 6.3.4 Direct Mode
      5. 6.3.5 Register Preset
    4. 6.4 Register Descriptions
      1. 6.4.1 Control Registers - Main Configuration Registers
      2. 6.4.2 Control Registers - Sublevel Configuration Registers
      3. 6.4.3 Status Registers
      4. 6.4.4 FIFO Control Registers
    5. 6.5 Direct Commands From MCU to Reader
      1. 6.5.1  Command Codes
      2. 6.5.2  Reset FIFO
      3. 6.5.3  Transmission With CRC
      4. 6.5.4  Transmission Without CRC
      5. 6.5.5  Delayed Transmission With CRC
      6. 6.5.6  Delayed Transmission Without CRC
      7. 6.5.7  Transmit Next Time Slot
      8. 6.5.8  Receiver Gain Adjust
      9. 6.5.9  Test External RF (RSSI at RX Input With TX Off)
      10. 6.5.10 Test Internal RF (RSSI at RX Input With TX On)
      11. 6.5.11 Block Receiver
      12. 6.5.12 Enable Receiver
    6. 6.6 Reader Communication Interface
      1. 6.6.1 Introduction
    7. 6.7 Parallel Interface Communication
      1. 6.7.1 Receive
      2. 6.7.2 Transmit
    8. 6.8 Serial Interface Communication
      1. 6.8.1 SPI Without SS* (Slave Select) Pin
      2. 6.8.2 SPI With SS* (Slave Select) Pin
        1. 6.8.2.1 FIFO Operation
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Schematics
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Terminal Configuration and Functions

4.1 Pin Diagram

Figure 4-1 shows the pinout of the 32-pin RHB package.

TRF7960 TRF7961 ic_layout_los504.gif Figure 4-1 32-Pin RHB Package (Top View)

4.2 Signal Descriptions

Table 4-1 describes the device signals.

Table 4-1 Signal Descriptions

TERMINAL TYPE(1) DESCRIPTION
NAME NO.
VDD_A 1 OUT Internal regulated supply (2.7 V to 3.4 V) for analog circuitry
VIN 2 SUP External supply input to chip (2.7 V to 5.5 V)
VDD_RF 3 OUT Internal regulated supply (2.7 V to 5 V), normally connected to VDD_PA (pin 4)
VDD_PA 4 INP Supply for PA; normally connected externally to VDD_RF (pin 3)
TX_OUT 5 OUT RF output (selectable output power, 100 mW at 8 Ω or 200 mW at 4 Ω, with VDD = 5 V)
VSS_RF 6 SUP Negative supply for PA; normally connected to circuit ground
VSS_RX 7 SUP Negative supply for RX inputs; normally connected to circuit ground
RX_IN1 8 INP RX input, used for AM reception
RX_IN2 9 INP RX input, used for PM reception
VSS 10 SUP Chip substrate ground
BAND_GAP 11 OUT Band-gap voltage (1.6 V); internal analog voltage reference; must be AC-bypassed to ground
ASK/OOK 12 BID Also can be configured to provide the received analog signal output (ANA_OUT)
Direct mode, selects either ASK or OOK modulation (0 = ASK, 1 = OOK)
IRQ 13 OUT Interrupt request
MOD 14 INP Direct mode, external modulation input
VSS_A 15 SUP Negative supply for internal analog circuits; normally connected to circuit ground
VDD_I/O 16 SUP Supply for I/O communications (1.8 V to 5.5 V). Should be connected to VIN for 5-V communication, VDD_X for 3.3-V communication, or any other voltage from 1.8 V to 5.5 V.
I/O_0 17 BID I/O pin for parallel communication
I/O_1 18 BID I/O pin for parallel communication
I/O_2 19 BID I/O pin for parallel communication
I/O_3 20 BID I/O pin for parallel communication
I/O_4 21 BID I/O pin for parallel communication
I/O_5 22 BID I/O pin for parallel communication
Strobe out clock for serial communication
Data clock output in direct mode
I/O_6 23 BID I/O pin for parallel communication
MISO for serial communication (SPI)
Serial bit data output in direct mode 1 or subcarrier signal in direct mode 0
I/O_7 24 BID I/O pin for parallel communication.
MOSI for serial communication (SPI)
EN2 25 INP Pulse enable and selection of power-down mode. If EN2 is connected to VIN, then VDD_X is active during power down to support the MCU. Pin can also be used for pulse wake up from power-down mode.
DATA_CLK 26 INP Clock input for MCU communication (parallel and serial)
SYS_CLK 27 OUT Clock for MCU (3.39 / 6.78 / 13.56 MHz) at EN = 1 and EN2 = don't care
If EN = 0 and EN2 = 1, then system clock is set to 60 kHz
EN 28 INP Chip enable input (If EN = 0, then chip is in power-down mode.)
VSS_D 29 SUP Negative supply for internal digital circuits; normally connected to circuit ground
OSC_OUT 30 OUT Crystal oscillator output
OSC_IN 31 INP Crystal oscillator input
VDD_X 32 OUT Internally regulated supply (2.7 V to 3.4 V) for external circuitry (MCU)
Thermal Pad Connected to circuit ground
(1) SUP = Supply, INP = Input, BID = Bidirectional, OUT = Output