SCDS214F October   2005  – December 2021 TS5A3359

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 5-V Supply
    6. 6.6 Electrical Characteristics for 3.3-V Supply
    7. 6.7 Electrical Characteristics for 2.5-V Supply
    8. 6.8 Electrical Characteristics for 1.8-V Supply
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Parameter Measurement Information

GUID-15029FEB-9C49-4FF0-B6F0-35AEA24AEC1F-low.gif Figure 7-1 ON-State Resistance (Ron)
GUID-46C8093C-0383-44B2-8DD8-5CBBAE6E33D2-low.gif Figure 7-2 OFF-State Leakage Current (INC(OFF), INO(OFF), INO(PWROFF), ICOM(OFF), ICOM(PWROFF))
GUID-8C6B466F-C719-4850-BD8A-F8901CABC16E-low.gif Figure 7-3 ON-State Leakage Current (ICOM(ON), INO(ON))
GUID-CB594A58-59D9-4791-8FF5-A2529E545A40-low.gif Figure 7-4 Capacitance (CI, CCOM(ON), CNO(OFF), CCOM(OFF), CNO(ON))
GUID-D6BC078F-F403-470A-A579-2D58783C7546-low.gif
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 7-5 Turnon (tON) and Turnoff Time (tOFF)
GUID-72E53EEE-714B-4E07-A0F6-60E79186A84C-low.gif
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 7-6 Break-Before-Make Time (tBBM)
GUID-FCCEAED4-3DA9-4511-BA20-B47D63E9F769-low.gif Figure 7-7 Bandwidth (BW)
GUID-F495740C-7F99-4EDC-AAB5-1294EA2ED118-low.gif Figure 7-8 Off Isolation (OISO)
GUID-A5594FA7-5F05-4EFC-A994-8674D9DFEED2-low.gif Figure 7-9 Crosstalk (XTALK)
GUID-813F81F5-43BE-4F6D-A4A4-9B711953665E-low.gif
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 7-10 Charge Injection (QC)
GUID-EB1CE465-0083-4378-A15F-77CB2EA8B8EB-low.gif
CL includes probe and jig capacitance.
Figure 7-11 Total Harmonic Distortion (THD)
Table 7-1 Parameter Description
SYMBOL DESCRIPTION
VCOM Voltage at COM
VNO Voltage at NO
ron Resistance between COM and NC or COM and NO ports when the channel is ON
rpeak Peak ON-state resistance over a specified voltage range
Δron Difference of ron between channels in a specific device
ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state
INO(PWROFF) Leakage current measured at the NO port during the power-down condition, VCC = 0.
INO(ON) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM) open
ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the ON state and the output (NC or NO) open
ICOM(OFF) Leakage current measured at the COM port during the power-down condition, VCC = 0
ICOM(PWROFF) Leakage current measured at the COM port during the power-down condition, VCC = 0.
VIH Minimum input voltage for logic high for the control input (IN)
VIL Maximum input voltage for logic low for the control input (IN)
VI Voltage at the control input (IN)
IIH, IIL Leakage current measured at the control input (IN)
tON Turnon time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM or NO) signal when the switch is turning ON.
tOFF Turnoff time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM or NO) signal when the switch is turning OFF.
tBBM Break-before-make time. This parameter is measured under the specified range of conditions and by the propagation delay between the output of two adjacent analog channels (NC and NO) when the control signal changes state.
QC Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NO or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.Charge injection, QC = CL × ΔVCOM, CL is the load capacitance and ΔVCOM is the change in analog output voltage.
CNO(OFF) Capacitance at the NO port when the corresponding channel (NO to COM) is OFF
CNO(ON) Capacitance at the NO port when the corresponding channel (NO to COM) is ON
CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NO) is ON
CCOM(OFF) Capacitance at the COM port when the corresponding channel (COM to NO) is OFF
CI Capacitance of control input (IN)
OISO OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NC to COM or NO to COM) in the OFF state.
XTALK Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC to NO or NO to NC). This is measured in a specific frequency and in dB.
BW Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB less than the DC gain.
THD Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental harmonic.
ICC Static power-supply current with the control (IN) pin at VCC or GND
Table 7-2 Summary of Characteristics(1)
PARAMETER CHARACTERISTIC
Configuration Triple 3:1 Multiplexer/
Demultiplexer (1 × SP3T)
Number of channels 1
ON-state resistance (ron) 1.1 Ω
ON-state resistance match (Δron) 0.1 Ω
ON-state resistance flatness (ron(flat)) 0.15 Ω
Turnon/turnoff time (tON/tOFF) 40 ns/35 ns
Break-before-make time (tBBM) 1 ns
Charge injection (QC) 40 pC
Bandwidth (BW) 100 MHz
OFF isolation (OISO) –65 dB at 10 MHz
Crosstalk (XTALK) –66 dB at 10 MHz
Total harmonic distortion (THD) 0.01%
Leakage current (ICOM(OFF)/INO(OFF)) ±20 μA
Power supply current (ICC) 0.1 μA
Package options 8-pin DCU or YZP
(1) VCC = 5 V, TA = 25°C