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Product details

Parameters

Configuration 3:1 Number of channels (#) 1 Ron (Typ) (Ohms) 0.7 ON-state leakage current (Max) (µA) 0.22 Bandwidth (MHz) 75 Operating temperature range (C) -40 to 85 Features Powered-off protection, Break-before-make Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 78 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches/muxes

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches/muxes

Features

  • Isolation in Power-Down Mode, VCC = 0
  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (1 Ω)
  • Control Inputs Are 5.5-V Tolerant
  • Low Charge Injection (5 pC VCC = 1.8 V)
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
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Description

The TS5A3359 device is a bidirectional, single channel, single-pole triple-throw (SP3T) analog switch that is designed to operate from 1.65 V to 5.5 V. This device provides a signal switching solution while maintaining excellent signal integrity, which makes the TS5A3359 suitable for a wide range of applications in various markets including personal electronics, test and measurement equipment, and portable instrumentation. The device maintains the signal integrity by its low ON-state resistance, excellent ON-state resistance matching, and total harmonic distortion (THD) performance. To prevent signal distortion during the transferring of a signal from one channel to another, the TS5A3359 device also has a specified break-before-make feature. The device consumes very low power and provides isolation when VCC = 0.

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Technical documentation

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCDM164.ZIP (46 KB) - PSpice Model
SIMULATION MODELS Download
SCDM165.TSC (1783 KB) - TINA-TI Reference Design
SIMULATION MODELS Download
SCDM166.ZIP (5 KB) - TINA-TI Spice Model

Reference designs

REFERENCE DESIGNS Download
Wireless IoT, Bluetooth® Low Energy, 4½ Digit, 100kHz True RMS Digital Multimeter
TIDA-01012 — Many products are now becoming connected through the Internet of Things (IoT), including test equipment such as digital multimeters (DMM).  Enabled by Texas Instruments’ SimpleLink™ ultra-low power wireless microcontroller (MCU) platform, the TIDA-01012 reference design demonstrates (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Enhanced Accuracy Battery Fuel Gauge Reference Design for Low Power Industrial IoT Field Metering
TIDA-01014 The Internet of Things (IoT) revolution is efficiently connecting applications and instruments, enabling battery powered, wide scale very low power sensor deployment.  New technologies, such as TI’s advanced sensor and low power connectivity devices, are enabling these instruments to be (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Highly Integrated 4 1/2 Digit Low Power Handheld Digital Multimeter (DMM) Platform Reference Design
TIDA-00879 — The TIDA-00879 TI-Design leverages the features, functions, performance, and state-of-the-art low power and power management capabilities of the MSP430F6736 MCU to demonstrate a highly integrated, low cost, and low power Digital Multimeter platform.  The solution delivers 4.5 digits or 60K (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

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