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Product details

Parameters

Configuration 3:1 Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 0.7 ON-state leakage current (Max) (µA) 0.22 Bandwidth (MHz) 75 Operating temperature range (C) -40 to 85 Features Powered-off protection, Break-before-make Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 78 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches & muxes

Features

  • Isolation in Power-Down Mode, VCC = 0
  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (1 Ω)
  • Control Inputs Are 5.5-V Tolerant
  • Low Charge Injection (5 pC VCC = 1.8 V)
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
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Description

The TS5A3359 device is a bidirectional, single channel, single-pole triple-throw (SP3T) analog switch that is designed to operate from 1.65 V to 5.5 V. This device provides a signal switching solution while maintaining excellent signal integrity, which makes the TS5A3359 suitable for a wide range of applications in various markets including personal electronics, test and measurement equipment, and portable instrumentation. The device maintains the signal integrity by its low ON-state resistance, excellent ON-state resistance matching, and total harmonic distortion (THD) performance. To prevent signal distortion during the transferring of a signal from one channel to another, the TS5A3359 device also has a specified break-before-make feature. The device consumes very low power and provides isolation when VCC = 0.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 7
Type Title Date
* Datasheet TS5A3359 1-Ω SP3T Bidirectional Analog Switch 5-V/3.3-V Single-Channel 3:1 Multiplexer and Demultiplexer datasheet (Rev. E) Jan. 25, 2016
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Using ADS8411 in a Multiplexed Analog Input Application (Rev. A) Feb. 15, 2006
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM164.ZIP (46 KB) - PSpice Model
SIMULATION MODEL Download
SCDM165.TSC (1783 KB) - TINA-TI Reference Design
SIMULATION MODEL Download
SCDM166.ZIP (5 KB) - TINA-TI Spice Model

Reference designs

REFERENCE DESIGNS Download
Enhanced Accuracy Battery Fuel Gauge Reference Design for Low Power Industrial IoT Field Metering
TIDA-01014 The Internet of Things (IoT) revolution is efficiently connecting applications and instruments, enabling battery powered, wide scale very low power sensor deployment.  New technologies, such as TI’s advanced sensor and low power connectivity devices, are enabling these instruments to be (...)
document-generic Schematic
REFERENCE DESIGNS Download
Highly Integrated 4 1/2 Digit Low Power Handheld Digital Multimeter (DMM) Platform Reference Design
TIDA-00879 — The TIDA-00879 TI-Design leverages the features, functions, performance, and state-of-the-art low power and power management capabilities of the MSP430F6736 MCU to demonstrate a highly integrated, low cost, and low power Digital Multimeter platform.  The solution delivers 4.5 digits or 60K (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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