SLVSH43 july   2023 TSD05

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information
    2. 9.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYF|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC (1) TSD05 UNIT
DYF (SOD-323)
2 PINS
RθJA Junction-to-ambient thermal resistance 672.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 230.5 °C/W
RθJB Junction-to-board thermal resistance 541.4 °C/W
ΨJT Junction-to-top characterization parameter 64.4 °C/W
ΨJB Junction-to-board characterization parameter 527.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.