SLVSH43 july   2023 TSD05

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information
    2. 9.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYF|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics

At TA=25℃ (unless otherwise noted) (1)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
VRWM Reverse stand-off voltage IIO <50 nA, across operating temperature range 5.5 V
ILEAK Reverse leakage current VIO = 5.5 V, IO to GND 5 50 nA
VBR Break-down voltage IIO = 1 mA, IO to GND 6 7 8 V
VFWD Forward voltage IIO = 1 mA,  GND to IO 0.7 V
VCLAMP Surge clamping voltage, tp = 8/20 µs (2) IPP = 24 A, IO to GND 8 V
IPP = 60 A, IO to GND 9 V
IPP = 60 A, GND to IO 5.5 V
TLP clamping voltage, tp = 100 ns IPP = 16 A, IO to GND 7.5 V
IPP =16 A, GND to IO 1.1 V
CL Line capacitance VIO = 0 V;  ƒ = 1 MHz, IO to GND 19 pF
(1) Typical parameters are measured at 25℃
(2) Nonrepetitive current pulse 8 to 20 µs exponentially decaying waveform according to IEC 61000-4-5