SLVSHX0 October   2024 TSD12C-Q1 , TSD15C-Q1 , TSD18C-Q1 , TSD24C-Q1 , TSD36C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - AEC Specifications
    3. 5.3  ESD Ratings—IEC Specification
    4. 5.4  ESD Ratings - ISO Specifications
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics - TSD12C-Q1
    8. 5.8  Electrical Characteristics - TSD15C-Q1
    9. 5.9  Electrical Characteristics - TSD18C-Q1
    10. 5.10 Electrical Characteristics - TSD24C-Q1
    11. 5.11 Electrical Characteristics - TSD36C-Q1
    12. 5.12 Typical Characteristics
  7. 6 Application and Implementation
  8. 7 Application Information
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings - AEC Specifications

Parameter Test Conditions VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q101-001(1) ±2500 V
Charged device model (CDM), per AEC Q101-005(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.