SLVSHX1 June   2025 TSD12-Q1 , TSD15-Q1 , TSD18-Q1 , TSD24-Q1 , TSD36-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - AEC Specifications
    3. 5.3  ESD Ratings - IEC Specification
    4. 5.4  ESD Ratings - ISO Specifications
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics - TSD12-Q1
    8. 5.8  Electrical Characteristics - TSD15-Q1
    9. 5.9  Electrical Characteristics - TSD18-Q1
    10. 5.10 Electrical Characteristics - TSD24-Q1
    11. 5.11 Electrical Characteristics - TSD36-Q1
    12. 5.12 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings - AEC Specifications

Parameter Test Conditions VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q101-001(1) ±2500 V
Charged device model (CDM), per AEC Q101-005(2) ±1000
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.