SLLSEK4B July   2015  – January 2016 TUSB4041I-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 3.3-V I/O Electrical Characteristics
    6. 7.6 Power-Up Timing Requirements
    7. 7.7 Hub Input Supply Current
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Battery Charging Features
      2. 8.3.2 USB Power Management
      3. 8.3.3 One-Time Programmable Configuration
      4. 8.3.4 Clock Generation
      5. 8.3.5 Crystal Requirements
      6. 8.3.6 Input Clock Requirements
      7. 8.3.7 Power-Up and Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Configuration Interface
      2. 8.4.2 I2C EEPROM Operation
      3. 8.4.3 SMBus Slave Operation
    5. 8.5 Register Maps
      1. 8.5.1  Configuration Registers
      2. 8.5.2  ROM Signature Register
      3. 8.5.3  Vendor ID LSB Register
      4. 8.5.4  Vendor ID MSB Register
      5. 8.5.5  Product ID LSB Register
      6. 8.5.6  Product ID MSB Register
      7. 8.5.7  Device Configuration Register
      8. 8.5.8  Battery Charging Support Register
      9. 8.5.9  Device Removable Configuration Register
      10. 8.5.10 Port Used Configuration Register
      11. 8.5.11 Device Configuration Register 2
      12. 8.5.12 USB 2.0 Port Polarity Control Register
      13. 8.5.13 UUID Byte N Register
      14. 8.5.14 Language ID LSB Register
      15. 8.5.15 Language ID MSB Register
      16. 8.5.16 Serial Number String Length Register
      17. 8.5.17 Manufacturer String Length Register
      18. 8.5.18 Product String Length Register
      19. 8.5.19 Serial Number String Registers
      20. 8.5.20 Manufacturer String Registers
      21. 8.5.21 Product String Byte N Register
      22. 8.5.22 Additional Feature Configuration Register
      23. 8.5.23 Device Status and Command Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Upstream Port Implementation
        2. 9.2.2.2 Downstream Port 1 Implementation
        3. 9.2.2.3 Downstream Port 2 Implementation
        4. 9.2.2.4 Downstream Port 3 Implementation
        5. 9.2.2.5 Downstream Port 4 Implementation
        6. 9.2.2.6 VBUS Power Switch Implementation
        7. 9.2.2.7 Clock, Reset, and Miscellaneous
        8. 9.2.2.8 TUSB4041I-Q1 Power Implementation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 TUSB4041I-Q1 Power Supply
    2. 10.2 Downstream Port Power
    3. 10.3 Ground
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Placement
      2. 11.1.2 Package Specific
      3. 11.1.3 Differential Pairs
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

  • Selection and Specification of Crystals for Texas Instruments USB 2.0 Devices, SLLA122
  • TPS2561 Dual-Channel Precision Adjustable Current-limited Power Switches, SLVS930
  • TUSB4041PAP Evaluation Module, SLLU227

12.2 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

PowerPAD is a trademark of TI.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.