SCES940A February   2022  – May 2024 TXU0101

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions—TXU0101
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 ± 0.1V
    7. 5.7  Switching Characteristics, VCCA = 1.5 ± 0.1V
    8. 5.8  Switching Characteristics, VCCA = 1.8 ± 0.15V
    9. 5.9  Switching Characteristics, VCCA = 2.5 ± 0.2V
    10. 5.10 Switching Characteristics, VCCA = 3.3 ± 0.3V
    11. 5.11 Switching Characteristics, VCCA = 5.0 ± 0.5V
    12. 5.12 Operating Characteristics
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 7.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 7.3.2 Control Logic (OE) with VCC(MIN) Circuitry
      3. 7.3.3 Balanced High-Drive CMOS Push-Pull Outputs
      4. 7.3.4 VCC Isolation and VCC Disconnect
      5. 7.3.5 Over-Voltage Tolerant Inputs
      6. 7.3.6 Glitch-Free Power Supply Sequencing
      7. 7.3.7 Negative Clamping Diodes
      8. 7.3.8 Fully Configurable Dual-Rail Design
      9. 7.3.9 Supports High-Speed Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Regulatory Requirements
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DTQ|6
  • DCK|6
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.6 Electrostatic Discharge Caution

TXU0101 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.