SLUS872E January   2009  – February 2019 UC1842A-SP , UC1844A-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics (Radiation-Improved Devices)
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 UVLO
      2. 8.3.2 Reference
      3. 8.3.3 Totem-Pole Output
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Oscillator
        2. 9.2.2.2 Current Sensing and Limiting
        3. 9.2.2.3 Error Amplifier
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Feedback Traces
      2. 11.1.2 Input/Output Capacitors
      3. 11.1.3 Compensation Components
      4. 11.1.4 Traces and Ground Planes
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) UC184xA-SP UNIT
JG (CDIP) FK (LCCC)
8 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 103 — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.6 9.0 °C/W
RθJB Junction-to-board thermal resistance 69.2 — °C/W
ψJT Junction-to-top characterization parameter 13.9 — °C/W
ψJB Junction-to-board characterization parameter 73 — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.