SLUSFZ6 September   2025 UCC218915-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Power Ratings
    6. 5.6 Insulation Specifications
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power Supplies
      2. 6.3.2  VCC and VDD Undervoltage Lockout (UVLO)
      3. 6.3.3  Input Filters for IN+, IN- and RST/EN
      4. 6.3.4  Pre-Driver Outputs
      5. 6.3.5  External Active Miller Clamp
      6. 6.3.6  Desaturation (DESAT) Protection
      7. 6.3.7  Soft Shutdown
      8. 6.3.8  Fault (FLT), Reset and Enable (RST/EN)
      9. 6.3.9  Active Short Circuit (ASC) Support and Feedback (ASC_FB)
      10. 6.3.10 Overtemperature Protection
    4. 6.4 Device Functional Modes
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Filters for IN+, IN- and RST/EN
        2. 7.2.2.2 PWM Interlock of IN+ and IN-
        3. 7.2.2.3 FLT, RDY, and RST/EN Pin Circuitry
        4. 7.2.2.4 RST/EN Pin Control
        5. 7.2.2.5 External Active Miller Clamp
        6. 7.2.2.6 Overcurrent and Short Circuit Protection
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DFP|28
Thermal pad, mechanical data (Package|Pins)

6.3.10 Overtemperature Protection

The silicon junction temperature is monitored to prevent the driver IC from damage during overheating conditions. When the device temperature exceeds it's 150°C maximum rating, the NMOS buffer FET driver output, OUTN, is held on so that the main power switch will be held off. The driver output will not turn on the PMOS buffer FET until the temperature recovers to 20°C below the thermal shutdown temperature, TTSDTH. While the driver is in thermal shutdown, the RDY pin on the input side is held low and connected to GND.