SLUSF58B December   2023  – June 2025 UCC23525

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Function
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Thermal Derating Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Propagation Delay, Rise Time and Fall Time
    2. 6.2 IOH and IOL Testing
    3. 6.3 CMTI Testing
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supply
      2. 7.3.2 Input Stage
      3. 7.3.3 Output Stage
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Undervoltage Lockout (UVLO)
        2. 7.3.4.2 Active Pulldown
        3. 7.3.4.3 Short-Circuit Clamping
        4. 7.3.4.4 ESD Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting the Input Resistor
        2. 8.2.2.2 Gate Driver Output Resistor
        3. 8.2.2.3 Estimate Gate-Driver Power Loss
        4. 8.2.2.4 Estimating Junction Temperature
        5. 8.2.2.5 Selecting VDD Capacitor
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 PCB Material
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Safety Limiting Values

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current RqJA = 138°C/W, VDD - VSS = 15 V, TJ = 150°C, TA = 25°C 59 mA
RqJA = 138°C/W, VDD - VSS = 25 V, TJ = 150°C, TA = 25°C 35
PS Safety input, output, or total power RqJA = 138°C/W, TJ = 150°C, TA = 25°C 900 mW
TS Maximum safety temperature(1) 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ , specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.
The junction-to-air thermal resistance, RqJA, in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RqJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RqJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI , where VI is the maximum supply voltage.