SLUS504H SEPTEMBER   2002  – January 2016 UCC27321 , UCC27322 , UCC37321 , UCC37322


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Power Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
      3. 8.3.3 Source and Sink Capabilities during Miller Plateau
      4. 8.3.4 Enable
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. Input-to-Output Configuration
        2. Input Threshold Type
        3. VDD Bias Supply Voltage
        4. Peak Source and Sink Currents
        5. Enable and Disable Function
        6. Propagation Delay
        7. Power Dissipation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Related Products
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Related Products

UCC37323/4/5 Dual 4-A Low-Side Drivers MSOP–8 PowerPAD, SOIC–8, PDIP–8
UCC27423/4/5 Dual 4-A Low-Side Drivers with Enable MSOP–8 PowerPAD, SOIC–8, PDIP–8
TPS2811/12/13 Dual 2-A Low-Side Drivers with Internal Regulator TSSOP–8, SOIC–8, PDIP–8
TPS2814/15 Dual 2-A Low-Side Drivers with Two Inputs per Channel TSSOP–8, SOIC–8, PDIP–8
TPS2816/17/18/19 Single 2-A Low-Side Driver with Internal Regulator 5-Pin SOT–23
TPS2828/29 Single 2-A Low-Side Driver 5-Pin SOT–23

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see the following:

  1. SEM-1400, Topic 2, A Design and Application Guide for High Speed Power MOSFET Gate Drive Circuits
  2. U-137, Practical Considerations in High PerformanceMOSFET, IGBT andMCTGateDrive Circuits, by Bill Andreycak (SLUA105)
  3. Technical Brief, PowerPad Thermally Enhanced Package (SLMA002)
  4. Application Brief, PowerPAD Made Easy (SLMA004)
  5. Data Book, Power Supply Control Products, (SLUD003)

12.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

UCC27321 Click here Click here Click here Click here Click here
UCC27322 Click here Click here Click here Click here Click here
UCC37321 Click here Click here Click here Click here Click here
UCC37322 Click here Click here Click here Click here Click here

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution


These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.