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Product details

Parameters

Number of channels (#) 1 Power switch MOSFET, IGBT Peak output current (A) 9 Input VCC (Min) (V) 4 Input VCC (Max) (V) 15 Features Enable Pin Operating temperature range (C) 0 to 70 Rise time (ns) 20 Fall time (ns) 20 Prop delay (ns) 25 Input threshold CMOS, TTL Channel input logic Non-Inverting Input negative voltage (V) 0 Rating Catalog open-in-new Find other Low-side drivers

Package | Pins | Size

HVSSOP (DGN) 8 15 mm² 3 x 4.9 PDIP (P) 8 93 mm² 9.81 x 9.43 SOIC (D) 8 19 mm² 3.91 x 4.9 open-in-new Find other Low-side drivers

Features

  • Industry-Standard Pin-Out With Addition of Enable
    Function
  • High-Peak Current Drive Capability of ±9 A at
    theMiller plateau region Using TrueDrive
  • Efficient Constant Current Sourcing Using a
    Unique BiPolar and CMOS Output Stage
  • TTL/CMOS Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and Fall Times With 10-nF
    Load
  • Typical Propagation Delay Times of 25 ns With
    Input Falling and 35 ns With Input Rising
  • 4-V to 15-V Supply Voltage
  • Available in Thermally Enhanced MSOP
    PowerPAD™ Package With 4.7°C/W θjc
  • Rated From –40°C to +105°C
  • Pb-Free Finish (CU NIPDAU) on 8-pin SOIC and
    PDIP Packages
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Description

The UCC2732x/UCC3732x family of high-speed drivers deliver 9 A of peak drive current in an industry standard pinout. These drivers can drive the largest of MOSFETs for systems requiring extreme Miller current due to high dV/dt transitions. This eliminates additional external circuits and can replace multiple components to reduce space, design complexity, and assembly cost. Two standard logic options are offered, inverting (UCC37321) and noninverting (UCC37322).

Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive current where it is most needed at theMiller plateau region during the MOSFET switching transition. A unique hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages. With this drive architecture, UCC3732x can be used in industry standard 6-A, 9-A and many 12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the UCC3732x provides an enable (ENBL) function to have better control of the operation of the driver applications. ENBL is implemented on pin 3, which was previously left unused in the industry standard pinout. It is internally pulled up to VDD for active high logic and can be left open for standard operation.

In addition to the 8-pin SOIC (D) and 8-pin PDIP (P) package offerings, the UCC3732x also comes in the thermally enhanced but tiny 8-pin MSOP PowerPAD™ (DGN) package. The PowerPAD package drastically lowers the thermal resistance to extend the temperature operation range and improve the long-term reliability.

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Technical documentation

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Design tools & simulation

SIMULATION MODELS Download
SLUM295.ZIP (27 KB) - PSpice Model
SIMULATION MODELS Download
SLUM447.ZIP (12 KB) - TINA-TI Spice Model
SIMULATION MODELS Download
SLUM448.TSC (65 KB) - TINA-TI Reference Design
SIMULATION MODELS Download
SLUM506.ZIP (2 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
HVSSOP (DGN) 8 View options
PDIP (P) 8 View options
SOIC (D) 8 View options

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