SLUSEX2A September   2025  – September 2025 UCC27734 , UCC27735

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Electrical Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stages and Interlock
      2. 6.3.2 Enable Function (UCC277x5 Only)
      3. 6.3.3 Undervoltage Lockout (UVLO)
      4. 6.3.4 Level Shifter
      5. 6.3.5 Output Stage
      6. 6.3.6 Low Propagation Delays and Tightly Matched Outputs
      7. 6.3.7 HS Node dV/dt
      8. 6.3.8 Split Grounds (COM and VSS)
      9. 6.3.9 Operation Under Negative HS Voltage Condition
    4. 6.4 Device Functional Modes
      1. 6.4.1 Input and Output Logic Table
      2. 6.4.2 Operation Under 100% Duty Cycle Condition
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
        2. 7.2.2.2 Selecting Bootstrap Capacitor (CBOOT)
        3. 7.2.2.3 Selecting VDD Bypass Capacitor (CVDD)
        4. 7.2.2.4 Selecting Bootstrap Resistor (RBOOT)
        5. 7.2.2.5 Selecting Gate Resistor RHO/RLO
        6. 7.2.2.6 Selecting Bootstrap Diode
        7. 7.2.2.7 Estimate the UCC2773x Power Losses
        8. 7.2.2.8 Application Example Schematic Note
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High-side, low-side configuration, with independent inputs
  • Maximum bootstrap voltage of +700V (HB pin)
  • Peak output current of 4A sink, 3.5A source
  • Typical 32ns propagation delay
  • Propagation delay matching between HO/LO within 6ns maximum
  • VDD bias supply range of 10V to 21V
  • Input pins capable of handling –6V
  • Floating channel designed for bootstrap operation
  • 200V/ns maximum common-mode transient immunity on HS pin
  • Input interlocking function (UCC2773x)
  • Built-in 8V Undervoltage Lockout (UVLO) for both channels
  • SOIC 14-pin package, SOIC 8-pin package