SGLS121E July   2002  – April 2025 UCC2800-Q1 , UCC2801-Q1 , UCC2802-Q1 , UCC2803-Q1 , UCC2804-Q1 , UCC2805-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Detailed Pin Description
        1. 7.3.1.1 COMP
        2. 7.3.1.2 FB
        3. 7.3.1.3 CS
        4. 7.3.1.4 RC
        5. 7.3.1.5 GND
        6. 7.3.1.6 OUT
        7. 7.3.1.7 VCC
        8. 7.3.1.8 Pin 8 (REF)
      2. 7.3.2  Undervoltage Lockout (UVLO)
      3. 7.3.3  Self-Biasing, Active Low Output
      4. 7.3.4  Reference Voltage
      5. 7.3.5  Oscillator
      6. 7.3.6  Synchronization
      7. 7.3.7  PWM Generator
      8. 7.3.8  Minimum Off-Time Setting (Dead-Time Control)
      9. 7.3.9  Leading Edge Blanking
      10. 7.3.10 Minimum Pulse Width
      11. 7.3.11 Current Limiting
      12. 7.3.12 Overcurrent Protection and Full Cycle Restart
      13. 7.3.13 Soft Start
      14. 7.3.14 Slope Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 UVLO Mode
      3. 7.4.3 Soft Start Mode
      4. 7.4.4 Fault Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Current Sensing Network
        2. 8.2.2.2 Gate Drive Resistor
        3. 8.2.2.3 Vref Capacitor
        4. 8.2.2.4 RTCT
        5. 8.2.2.5 Start-Up Circuit
        6. 8.2.2.6 Voltage Feedback Compensation
          1. 8.2.2.6.1 Power Stage Gain, Zeroes, and Poles
          2. 8.2.2.6.2 Compensation Loop
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision D (June 2020) to Revision E (April 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed power dissipation info for L, N, and J packages in Absolute Maximum Rating sectionGo
  • Updated TA and removed TJ in Recommended Operating Conditions sectionGo
  • Updated thermal resistance of D package in Thermal Information sectionGo
  • Added "Vref vs Temperature" and "Error Amp. Input vs Temperature" figures in Typical Characteristics sectionGo

Changes from Revision C (April 2008) to Revision D (June 2020)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added More details in Absolute max section Go
  • Changed Power Supply Recommendation section Go