SLVSA30D April   2011  – March  2019 UCD9090

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C/Smbus/PMBus Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TI Fusion User Interface (UI)
      2. 7.3.2 PMBus Interface
      3. 7.3.3 Rail Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power-Supply Sequencing
        1. 7.4.1.1 Turn-On Sequencing
        2. 7.4.1.2 Turn-Off Sequencing
        3. 7.4.1.3 Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Monitoring
        1. 7.4.3.1 Voltage Monitoring
        2. 7.4.3.2 Current Monitoring
        3. 7.4.3.3 Remote Temperature Monitoring and Internal Temperature Sensor
        4. 7.4.3.4 Temperature by Host Input
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
        1. 7.4.8.1 GPO Delays
        2. 7.4.8.2 State Machine Mode Enable
      9. 7.4.9  GPI Special Functions
      10. 7.4.10 Power-Supply Enable Pins
      11. 7.4.11 Cascading Multiple Devices
        1. 7.4.11.1 Connecting the GPIO Pin to a PMBus_CNTRL Pin
        2. 7.4.11.2 Connecting the GPIO Pin to a MON Pin
      12. 7.4.12 PWM Outputs
        1. 7.4.12.1 FPWM1-8
        2. 7.4.12.2 PWM1-2
      13. 7.4.13 Programmable Multiphase PWMs
      14. 7.4.14 Margining
        1. 7.4.14.1 Open-Loop Margining
        2. 7.4.14.2 Closed-Loop Margining
      15. 7.4.15 Run Time Clock
      16. 7.4.16 System Reset Signal
      17. 7.4.17 Watch Dog Timer
      18. 7.4.18 Data and Error Logging to Flash Memory
      19. 7.4.19 Brownout Function
      20. 7.4.20 PMBus Address Selection
      21. 7.4.21 Device Reset
      22. 7.4.22 JTAG Interface
      23. 7.4.23 Internal Fault Management and Memory Error Correction (ECC)
    5. 7.5 Programming
      1. 7.5.1 Full Configuration Update While in Normal Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Estimating ADC Reporting Accuracy
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
SUPPLY CURRENT
IV33A Supply current(1) VV33A = 3.3 V 8 mA
IV33DIO VV33DIO = 3.3 V 2 mA
IV33D VV33D = 3.3 V 40 mA
IV33D VV33D = 3.3 V, storing configuration parameters in flash memory 50 mA
ANALOG INPUTS (MON1–MON13)
VMON Input voltage range MON1–MON10 0 2.5 V
MON11 0.2 2.5 V
INL ADC integral nonlinearity –4 4 LSB
DNL ADC differential nonlinearity -2 2 LSB
Ilkg Input leakage current 3 V applied to pin 100 nA
IOFFSET Input offset current 1-kΩ source impedance –5 5 μA
RIN Input impedance MON1–MON10, ground reference 8 MΩ
MON11, ground reference 0.5 1.5 3 MΩ
CIN Input capacitance 10 pF
tCONVERT ADC sample period 12 voltages sampled, 3.89 μs/sample 400 μs
VREF ADC 2.5 V, internal reference accuracy 0°C to 125°C –0.5% 0.5%
–40°C to 125°C –1% 1%
ANALOG INPUT (PMBus_ADDRx)
IBIAS Bias current for PMBus Addr pins 9 11 μA
VADDR_OPEN Voltage – open pin PMBus_ADDR0, PMBus_ADDR1 open 2.26 V
VADDR_SHORT Voltage – shorted pin PMBus_ADDR0, PMBus_ADDR1 short to ground 0.124 V
DIGITAL INPUTS AND OUTPUTS
VOL Low-level output voltage IOL = 6 mA(2), V33DIO = 3 V Dgnd + 0.25 V
VOH High-level output voltage IOH = –6 mA(3), V33DIO = 3 V V33DIO
– 0.6		 V
VIH High-level input voltage V33DIO = 3 V 2.1 3.6 V
VIL Low-level input voltage V33DIO = 3.5 V 1.4 V
MARGINING OUTPUTS
TPWM_FREQ MARGINING-PWM frequency FPWM1-8 15.260 125000 kHz
PWM1-2 0.001 7800
DUTYPWM MARGINING-PWM duty cycle range 0% 100%
SYSTEM PERFORMANCE
VDDSlew Minimum VDD slew rate VDD slew rate between 2.3 V and 2.9 V 0.25 V/ms
VRESET Supply voltage at which device comes out of reset For power-on reset (POR) 2.4 V
tRESET Low-pulse duration needed at RESET pin To reset device during normal operation 2 μS
f(PCLK) Internal oscillator frequency TA = 125°C, TA = 25°C 240 250 260 MHz
tretention Retention of configuration parameters TJ = 25°C 100 Years
Write_Cycles Number of nonvolatile erase/write cycles TJ = 25°C 20 K cycles
(1) Typical supply current values are based on device programmed but not configured, and no peripherals connected to any pins.
(2) The maximum total current, IOLmax, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.
(3) The maximum total current, IOHmax, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.