SCHS173D November   1997  – November 2021 CD54HC259 , CD54HCT259 , CD74HC259 , CD74HCT259

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Prerequisite for Switching Characteristics
    6. 5.6 Switching Characteristics (2)
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Buffered inputs and outputs
  • Four operating modes
  • Typical propagation delay of 15ns at VCC = 5V, CL = 15pF, TA = 25oC
  • Fanout (over temperature range)
    • Standard Outputs: 10 LSTTL loads
    • Bus driver outputs: 15 LSTTL loads
  • Wide operating temperature range: -55oC to 125oC
  • Balanced propagation delay and transition times
  • Significant power reduction compared to LSTTL logic ICs
  • HC types
    • 2 V to 6 V operation
    • High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V
  • HCT types
    • 4.5 V to 5.5 V operation
    • Direct LSTTL input logic compatability, VIL = 0.8 V (max), VIH = 2 V (min)
    • CMOS input compatibility, II ≤ 1µA at VOL, VOH