SLPS517C December   2014  – February 2022 CSD13383F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Support Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Low on-resistance
  • Ultra low Qg and Qgd
  • Ultra-small footprint (0402 case size)
    • 1.0 mm × 0.6 mm
  • Low profile
    • 0.36 mm height
  • Integrated ESD protection diode
    • Rated >2 kV HBM
    • Rated >2 kV CDM
  • Lead and halogen free
  • RoHS compliant