SNLS614B September   2018  – December 2022 DP83869HM

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Timing Diagrams
    8. 8.8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  WoL (Wake-on-LAN) Packet Detection
        1. 9.3.1.1 Magic Packet Structure
        2. 9.3.1.2 Magic Packet Example
        3. 9.3.1.3 Wake-on-LAN Configuration and Status
      2. 9.3.2  Start of Frame Detect for IEEE 1588 Time Stamp
        1. 9.3.2.1 SFD Latency Variation and Determinism
          1. 9.3.2.1.1 1000-Mb SFD Variation in Master Mode
          2. 9.3.2.1.2 1000-Mb SFD Variation in Slave Mode
          3. 9.3.2.1.3 100-Mb SFD Variation
      3. 9.3.3  Clock Output
      4. 9.3.4  Loopback Mode
        1. 9.3.4.1 Near-End Loopback
          1. 9.3.4.1.1 MII Loopback
          2. 9.3.4.1.2 PCS Loopback
          3. 9.3.4.1.3 Digital Loopback
          4. 9.3.4.1.4 Analog Loopback
          5. 9.3.4.1.5 External Loopback
          6. 9.3.4.1.6 Far-End (Reverse) Loopback
        2.       39
      5. 9.3.5  BIST Configuration
      6. 9.3.6  Interrupt
      7. 9.3.7  Power-Saving Modes
        1. 9.3.7.1 IEEE Power Down
        2. 9.3.7.2 Active Sleep
        3. 9.3.7.3 Passive Sleep
      8. 9.3.8  Mirror Mode
      9. 9.3.9  Speed Optimization
      10. 9.3.10 Cable Diagnostics
        1. 9.3.10.1 TDR
      11. 9.3.11 Fast Link Drop
      12. 9.3.12 Jumbo Frames
    4. 9.4 Device Functional Modes
      1. 9.4.1  Copper Ethernet
        1. 9.4.1.1 1000BASE-T
        2. 9.4.1.2 100BASE-TX
        3. 9.4.1.3 10BASE-Te
      2. 9.4.2  Fiber Ethernet
        1. 9.4.2.1 1000BASE-X
        2. 9.4.2.2 100BASE-FX
      3. 9.4.3  Serial GMII (SGMII)
      4. 9.4.4  Reduced GMII (RGMII)
        1. 9.4.4.1 1000-Mbps Mode Operation
        2. 9.4.4.2 1000-Mbps Mode Timing
        3. 9.4.4.3 10- and 100-Mbps Mode
      5. 9.4.5  Media Independent Interface (MII)
      6. 9.4.6  Bridge Modes
        1. 9.4.6.1 RGMII-to-SGMII Mode
        2. 9.4.6.2 SGMII-to-RGMII Mode
        3.       69
      7. 9.4.7  Media Convertor Mode
      8. 9.4.8  Register Configuration for Operational Modes
        1. 9.4.8.1 RGMII-to-Copper Ethernet Mode
        2. 9.4.8.2 RGMII-to-1000Base-X Mode
        3. 9.4.8.3 RGMII-to-100Base-FX Mode
        4. 9.4.8.4 RGMII-to-SGMII Bridge Mode
        5. 9.4.8.5 1000M Media Convertor Mode
        6. 9.4.8.6 100M Media Convertor Mode
        7. 9.4.8.7 SGMII-to-Copper Ethernet Mode
      9. 9.4.9  Serial Management Interface
        1. 9.4.9.1 Extended Address Space Access
          1. 9.4.9.1.1 Write Address Operation
          2. 9.4.9.1.2 Read Address Operation
          3. 9.4.9.1.3 Write (No Post Increment) Operation
          4. 9.4.9.1.4 Read (No Post Increment) Operation
          5. 9.4.9.1.5 Write (Post Increment) Operation
          6. 9.4.9.1.6 Read (Post Increment) Operation
          7. 9.4.9.1.7 Example of Read Operation Using Indirect Register Access
          8. 9.4.9.1.8 Example of Write Operation Using Indirect Register Access
      10. 9.4.10 Auto-Negotiation
        1. 9.4.10.1 Speed and Duplex Selection - Priority Resolution
        2. 9.4.10.2 Master and Slave Resolution
        3. 9.4.10.3 Pause and Asymmetrical Pause Resolution
        4. 9.4.10.4 Next Page Support
        5. 9.4.10.5 Parallel Detection
        6. 9.4.10.6 Restart Auto-Negotiation
        7. 9.4.10.7 Enabling Auto-Negotiation Through Software
        8. 9.4.10.8 Auto-Negotiation Complete Time
        9. 9.4.10.9 Auto-MDIX Resolution
    5. 9.5 Programming
      1. 9.5.1 Strap Configuration
        1. 9.5.1.1 Straps for PHY Address
        2. 9.5.1.2 Strap for DP83869HM Functional Mode Selection
        3. 9.5.1.3 LED Default Configuration Based on Device Mode
        4. 9.5.1.4 Straps for RGMII/SGMII to Copper
        5. 9.5.1.5 Straps for RGMII to 1000Base-X
        6. 9.5.1.6 Straps for RGMII to 100Base-FX
        7. 9.5.1.7 Straps for Bridge Mode (SGMII-RGMII)
        8. 9.5.1.8 Straps for 100M Media Convertor
        9. 9.5.1.9 Straps for 1000M Media Convertor
      2. 9.5.2 LED Configuration
      3. 9.5.3 Reset Operation
        1. 9.5.3.1 Hardware Reset
        2. 9.5.3.2 IEEE Software Reset
        3. 9.5.3.3 Global Software Reset
        4. 9.5.3.4 Global Software Restart
    6. 9.6 Register Maps
      1. 9.6.1 DP83869 Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Copper Ethernet Typical Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Clock Input
            1. 10.2.1.2.1.1 Crystal Recommendations
            2. 10.2.1.2.1.2 External Clock Source Recommendation
          2. 10.2.1.2.2 Magnetics Requirements
            1. 10.2.1.2.2.1 Magnetics Connection
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Fiber Ethernet Typical Ethernet
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Transceiver Connections
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Two-Supply Configuration
    2. 11.2 Three-Supply Configuration
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Signal Traces
        1. 12.1.1.1 MAC Interface Layout Guidelines
          1. 12.1.1.1.1 SGMII Layout Guidelines
          2. 12.1.1.1.2 RGMII Layout Guidelines
        2. 12.1.1.2 MDI Layout Guidelines
      2. 12.1.2 Return Path
      3. 12.1.3 Transformer Layout
      4. 12.1.4 Metal Pour
      5. 12.1.5 PCB Layer Stacking
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Multiple operating modes
    • Media support: copper and fiber
    • Media conversion between copper and fiber
    • Bridge between RGMII and SGMII
  • Maximum ambient temperature available of 125°C
  • Exceeds 8-kV IEC61000-4-2 ESD
  • Low power consumption
    • < 150 mW for 1000Base-X
    • < 500 mW for 1000Base-T
  • Low RGMII latency
    • Total latency ≤ 384ns for 1000Base-T
    • Total latency ≤ 361ns for 100Base-TX
  • Time Sensitive Network (TSN) compliant
  • Recovered clock output for SyncE
  • Selectable synchronized clock output: 25 MHz and 125 MHz
  • SFF-8431 V4.1, 1000BASE-X and 100BASE-FX Compatible
  • IEEE1588 support via SFD
  • Wake on LAN support
  • Configurable IO voltages: 1.8 V, 2.5 V, and 3.3 V
  • SGMII, RGMII, MII MAC interface
  • Jumbo frame support for 1000M and 100M speed
  • Cable diagnostics
    • TDR
    • BIST
  • Programmable RGMII termination impedance
  • Integrated MDI termination resistor
  • Fast link drop modes
  • Conforms to IEEE 802.3 1000Base-T, 100Base-TX, 10Base-Te,1000Base-X, 100Base-FX