JAJSJL9A March   2021  – October 2021 ADS7067

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Input and Multiplexer
      2. 7.3.2  Reference
        1. 7.3.2.1 External Reference
        2. 7.3.2.2 Internal Reference
      3. 7.3.3  ADC Transfer Function
      4. 7.3.4  ADC Offset Calibration
      5. 7.3.5  Programmable Averaging Filters
      6. 7.3.6  CRC on Data Interface
      7. 7.3.7  Oscillator and Timing Control
      8. 7.3.8  Diagnostic Modes
        1. 7.3.8.1 Bit-Walk Test Mode
        2. 7.3.8.2 Fixed Voltage Test Mode
      9. 7.3.9  Output Data Format
        1. 7.3.9.1 Status Flags
        2. 7.3.9.2 Output CRC (Device to Host)
        3. 7.3.9.3 Input CRC (Host to Device)
      10. 7.3.10 Device Programming
        1. 7.3.10.1 Enhanced-SPI Interface
        2. 7.3.10.2 Daisy-Chain Mode
        3. 7.3.10.3 Register Read/Write Operation
          1. 7.3.10.3.1 Register Write
          2. 7.3.10.3.2 Register Read
            1. 7.3.10.3.2.1 Register Read With CRC
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Power-Up and Reset
      2. 7.4.2 Manual Mode
      3. 7.4.3 On-the-Fly Mode
      4. 7.4.4 Auto-Sequence Mode
    5. 7.5 ADS7067 Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Charge-Kickback Filter and ADC Amplifier
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 AVDD and DVDD Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

Figure 10-1 shows a board layout example for the ADS7067. Avoid crossing digital lines with the analog signal path and keep the analog input signals and the reference input signals away from noise sources.

Use 1-µF ceramic bypass capacitors in close proximity to the analog (AVDD) and digital (DVDD) power-supply pins. Avoid placing vias between the AVDD and DVDD pins and the bypass capacitors. Connect all ground pins to the ground plane using short, low-impedance paths.

Place the reference decoupling capacitor (CREF) close to the device REF and GND pins. Avoid placing vias between the REF pin and the bypass capacitors.

The charge-kickback RC filters are placed close to the device. Among ceramic surface-mount capacitors, COG- or NPO-type ceramic capacitors provide the best capacitance precision. The type of dielectric used in COG- or NPO-type ceramic capacitors provides the most stable electrical properties over voltage, frequency, and temperature changes.