JAJSGC7F December   2015  – May 2019 AM5726 , AM5728 , AM5729

PRODUCTION DATA.  

  1. デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 改訂履歴
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Port (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  External Memory Interface - (EMIF)
      5. 4.4.5  General-Purpose Memory Controller (GPMC)
      6. 4.4.6  Timer
      7. 4.4.7  Inter-Integrated Circuit Interface (I2C)
      8. 4.4.8  HDQ / 1-Wire Interface (HDQ1W)
      9. 4.4.9  Universal Asynchronous Receiver Transmitter (UART)
      10. 4.4.10 Multichannel Serial Peripheral Interface (McSPI)
      11. 4.4.11 Quad Serial Peripheral Interface (QSPI)
      12. 4.4.12 Multichannel Audio Serial Port (McASP)
      13. 4.4.13 Universal Serial Bus (USB)
      14. 4.4.14 Serial Advanced Technology Attachment (SATA)
      15. 4.4.15 Peripheral Component Interconnect Express (PCIe)
      16. 4.4.16 Controller Area Network Interface (DCAN)
      17. 4.4.17 Ethernet Interface (GMAC_SW)
      18. 4.4.18 Media Local Bus (MLB) Interface
      19. 4.4.19 eMMC/SD/SDIO
      20. 4.4.20 General-Purpose Interface (GPIO)
      21. 4.4.21 Keyboard controller (KBD)
      22. 4.4.22 Pulse Width Modulation (PWM)
      23. 4.4.23 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      24. 4.4.24 Test Interfaces
      25. 4.4.25 System and Miscellaneous
        1. 4.4.25.1 Sysboot
        2. 4.4.25.2 Power, Reset and Clock Management (PRCM)
        3. 4.4.25.3 Real-Time Clock (RTC) Interface
        4. 4.4.25.4 System Direct Memory Access (SDMA)
        5. 4.4.25.5 Interrupt Controllers (INTC)
        6. 4.4.25.6 Observability
        7. 4.4.25.7 Power Supplies
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power on Hours (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  BC1833IHHV Buffers DC Electrical Characteristics
      8. 5.7.8  USBPHY DC Electrical Characteristics
      9. 5.7.9  Dual Voltage SDIO1833 DC Electrical Characteristics
      10. 5.7.10 Dual Voltage LVCMOS DC Electrical Characteristics
      11. 5.7.11 SATAPHY DC Electrical Characteristics
      12. 5.7.12 PCIEPHY DC Electrical Characteristics
    8. 5.8 Thermal Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
    2. 6.2 RC On-die Oscillator Clock
    3. 6.3 DPLLs, DLLs Specifications
      1. 6.3.1 DPLL Characteristics
      2. 6.3.2 DLL Characteristics
  7. Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem – Video Output Ports
    8. 7.8  Display Subsystem – High-Definition Multimedia Interface (HDMI)
    9. 7.9  External Memory Interface (EMIF)
    10. 7.10 General-Purpose Memory Controller (GPMC)
      1. 7.10.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.10.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.10.3 GPMC/NAND Flash Interface Asynchronous Timing
    11. 7.11 Timers
    12. 7.12 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-34 Timing Requirements for I2C Input Timings
      2. Table 7-35 Timing Requirements for I2C HS-Mode (I2C3/4/5 Only)
      3. Table 7-36 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    13. 7.13 HDQ / 1-Wire Interface (HDQ1W)
      1. 7.13.1 HDQ / 1-Wire — HDQ Mode
      2. 7.13.2 HDQ/1-Wire—1-Wire Mode
    14. 7.14 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-41 Timing Requirements for UART
      2. Table 7-42 Switching Characteristics Over Recommended Operating Conditions for UART
    15. 7.15 Multichannel Serial Peripheral Interface (McSPI)
    16. 7.16 Quad Serial Peripheral Interface (QSPI)
    17. 7.17 Multichannel Audio Serial Port (McASP)
      1. Table 7-49 Timing Requirements for McASP1
      2. Table 7-50 Timing Requirements for McASP2
      3. Table 7-51 Timing Requirements for McASP3/4/5/6/7/8
      4. Table 7-52 Switching Characteristics Over Recommended Operating Conditions for McASP1
      5. Table 7-53 Switching Characteristics Over Recommended Operating Conditions for McASP2
      6. Table 7-54 Switching Characteristics Over Recommended Operating Conditions for McASP3/4/5/6/7/8
    18. 7.18 Universal Serial Bus (USB)
      1. 7.18.1 USB1 DRD PHY
      2. 7.18.2 USB2 PHY
    19. 7.19 Serial Advanced Technology Attachment (SATA)
    20. 7.20 Peripheral Component Interconnect Express (PCIe)
    21. 7.21 Controller Area Network Interface (DCAN)
    22. 7.22 Ethernet Interface (GMAC_SW)
      1. 7.22.1 GMAC MII Timings
        1. Table 7-68 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-69 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-70 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-71 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.22.2 GMAC MDIO Interface Timings
      3. 7.22.3 GMAC RMII Timings
        1. Table 7-76 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-77 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-78 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-79 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.22.4 GMAC RGMII Timings
        1. Table 7-83 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-84 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-85 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-86 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    23. 7.23 eMMC/SD/SDIO
      1. 7.23.1 MMC1—SD Card Interface
        1. 7.23.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.23.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.23.1.3 SDR12, 4-bit data, half-cycle
        4. 7.23.1.4 SDR25, 4-bit data, half-cycle
        5. 7.23.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.23.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.23.1.7 UHS-I DDR50, 4-bit data
      2. 7.23.2 MMC2 — eMMC
        1. 7.23.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.23.2.2 High-speed JC64 SDR, 8-bit data, half cycle
        3. 7.23.2.3 High-speed HS200 JC64 SDR, 8-bit data, half cycle
        4. 7.23.2.4 High-speed JC64 DDR, 8-bit data
      3. 7.23.3 MMC3 and MMC4—SDIO/SD
        1. 7.23.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.23.3.2 MMC3 and MMC4, SD High Speed
        3. 7.23.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.23.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.23.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    24. 7.24 General-Purpose Interface (GPIO)
    25. 7.25 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      1. 7.25.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. 7.25.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
          1. Table 7-135 PRU-ICSS PRU Timing Requirements - Direct Input Mode
          2. Table 7-136 PRU-ICSS PRU Switching Requirements – Direct Output Mode
        2. 7.25.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
          1. Table 7-137 PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
        3. 7.25.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
          1. Table 7-138 PRU-ICSS PRU Timing Requirements – Shift In Mode
          2. Table 7-139 PRU-ICSS PRU Switching Requirements - Shift Out Mode
      2. 7.25.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
        1. 7.25.2.1 PRU-ICSS ECAT Electrical Data and Timing
          1. Table 7-140 PRU-ICSS ECAT Timing Requirements – Input Validated With LATCH_IN
          2. Table 7-141 PRU-ICSS ECAT Timing Requirements – Input Validated With SYNCx
          3. Table 7-142 PRU-ICSS ECAT Timing Requirements – Input Validated With Start of Frame (SOF)
          4. Table 7-143 PRU-ICSS ECAT Timing Requirements - LATCHx_IN
          5. Table 7-144 PRU-ICSS ECAT Switching Requirements - Digital IOs
      3. 7.25.3 PRU-ICSS MII_RT and Switch
        1. 7.25.3.1 PRU-ICSS MDIO Electrical Data and Timing
          1. Table 7-145 PRU-ICSS MDIO Timing Requirements – MDIO_DATA
          2. Table 7-146 PRU-ICSS MDIO Switching Characteristics - MDIO_CLK
          3. Table 7-147 PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
        2. 7.25.3.2 PRU-ICSS MII_RT Electrical Data and Timing
          1. Table 7-148 PRU-ICSS MII_RT Timing Requirements – MII[x]_RXCLK
          2. Table 7-149 PRU-ICSS MII_RT Timing Requirements - MII[x]_TXCLK
          3. Table 7-150 PRU-ICSS MII_RT Timing Requirements - MII_RXD[3:0], MII_RXDV, and MII_RXER
          4. Table 7-151 PRU-ICSS MII_RT Switching Characteristics - MII_TXD[3:0] and MII_TXEN
      4. 7.25.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
        1. Table 7-152 Timing Requirements for PRU-ICSS UART Receive
        2. Table 7-153 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
      5. 7.25.5 PRU-ICSS IOSETs
      6. 7.25.6 PRU-ICSS Manual Functional Mapping
    26. 7.26 System and Miscellaneous interfaces
    27. 7.27 Test Interfaces
      1. 7.27.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.27.1.1 JTAG Electrical Data/Timing
          1. Table 7-174 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-175 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-176 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-177 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.27.2 Trace Port Interface Unit (TPIU)
        1. 7.27.2.1 TPIU PLL DDR Mode
  8. Applications, Implementation, and Layout
    1. 8.1 Power Supply Mapping
    2. 8.2 DDR3 Board Design and Layout Guidelines
      1. 8.2.1 DDR3 General Board Layout Guidelines
      2. 8.2.2 DDR3 Board Design and Layout Guidelines
        1. 8.2.2.1  Board Designs
        2. 8.2.2.2  DDR3 EMIFs
        3. 8.2.2.3  DDR3 Device Combinations
        4. 8.2.2.4  DDR3 Interface Schematic
          1. 8.2.2.4.1 32-Bit DDR3 Interface
          2. 8.2.2.4.2 16-Bit DDR3 Interface
        5. 8.2.2.5  Compatible JEDEC DDR3 Devices
        6. 8.2.2.6  PCB Stackup
        7. 8.2.2.7  Placement
        8. 8.2.2.8  DDR3 Keepout Region
        9. 8.2.2.9  Bulk Bypass Capacitors
        10. 8.2.2.10 High-Speed Bypass Capacitors
          1. 8.2.2.10.1 Return Current Bypass Capacitors
        11. 8.2.2.11 Net Classes
        12. 8.2.2.12 DDR3 Signal Termination
        13. 8.2.2.13 VREF_DDR Routing
        14. 8.2.2.14 VTT
        15. 8.2.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.2.2.15.1 Four DDR3 Devices
            1. 8.2.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.2.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.2.2.15.2 Two DDR3 Devices
            1. 8.2.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.2.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.2.2.15.3 One DDR3 Device
            1. 8.2.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.2.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.2.2.16 Data Topologies and Routing Definition
          1. 8.2.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.2.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.2.2.17 Routing Specification
          1. 8.2.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.2.2.17.2 DQS and DQ Routing Specification
    3. 8.3 High Speed Differential Signal Routing Guidance
    4. 8.4 Power Distribution Network Implementation Guidance
    5. 8.5 Thermal Solution Guidance
    6. 8.6 Single-Ended Interfaces
      1. 8.6.1 General Routing Guidelines
      2. 8.6.2 QSPI Board Design and Layout Guidelines
    7. 8.7 LJCB_REFN/P Connections
    8. 8.8 Clock Routing Guidelines
      1. 8.8.1 32-kHz Oscillator Routing
      2. 8.8.2 Oscillator Ground Connection
  9. Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Related Links
    5. 9.5 Community Resources
    6. 9.6 商標
    7. 9.7 静電気放電に関する注意事項
    8. 9.8 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • ABC|760
サーマルパッド・メカニカル・データ
発注情報

External Memory Interface - (EMIF)

NOTE

For more information, see the Memory Subsystem / EMIF Controller section of the device TRM.

Table 4-7 EMIF Signal Descriptions

SIGNAL NAME DESCRIPTION TYPE BALL
EMIF Channel 1
ddr1_csn0 EMIF1 Chip Select 0 O AH23
ddr1_cke EMIF1 Clock Enable O AG22
ddr1_ck EMIF1 Clock O AG24
ddr1_nck EMIF1 Negative Clock O AH24
ddr1_odt0 EMIF1 On-Die Termination for Chip Select 0 O AE20
ddr1_casn EMIF1 Column Address Strobe O AC18
ddr1_rasn EMIF1 Row Address Strobe O AF20
ddr1_wen EMIF1 Write Enable O AH21
ddr1_rst EMIF1 Reset output (DDR3-SDRAM only) O AG21
ddr1_ba0 EMIF1 Bank Address O AF17
ddr1_ba1 EMIF1 Bank Address O AE18
ddr1_ba2 EMIF1 Bank Address O AB18
ddr1_a0 EMIF1 Address Bus O AD20
ddr1_a1 EMIF1 Address Bus O AC19
ddr1_a2 EMIF1 Address Bus O AC20
ddr1_a3 EMIF1 Address Bus O AB19
ddr1_a4 EMIF1 Address Bus O AF21
ddr1_a5 EMIF1 Address Bus O AH22
ddr1_a6 EMIF1 Address Bus O AG23
ddr1_a7 EMIF1 Address Bus O AE21
ddr1_a8 EMIF1 Address Bus O AF22
ddr1_a9 EMIF1 Address Bus O AE22
ddr1_a10 EMIF1 Address Bus O AD21
ddr1_a11 EMIF1 Address Bus O AD22
ddr1_a12 EMIF1 Address Bus O AC21
ddr1_a13 EMIF1 Address Bus O AF18
ddr1_a14 EMIF1 Address Bus O AE17
ddr1_a15 EMIF1 Address Bus O AD18
ddr1_d0 EMIF1 Data Bus IO AF25
ddr1_d1 EMIF1 Data Bus IO AF26
ddr1_d2 EMIF1 Data Bus IO AG26
ddr1_d3 EMIF1 Data Bus IO AH26
ddr1_d4 EMIF1 Data Bus IO AF24
ddr1_d5 EMIF1 Data Bus IO AE24
ddr1_d6 EMIF1 Data Bus IO AF23
ddr1_d7 EMIF1 Data Bus IO AE23
ddr1_d8 EMIF1 Data Bus IO AC23
ddr1_d9 EMIF1 Data Bus IO AF27
ddr1_d10 EMIF1 Data Bus IO AG27
ddr1_d11 EMIF1 Data Bus IO AF28
ddr1_d12 EMIF1 Data Bus IO AE26
ddr1_d13 EMIF1 Data Bus IO AC25
ddr1_d14 EMIF1 Data Bus IO AC24
ddr1_d15 EMIF1 Data Bus IO AD25
ddr1_d16 EMIF1 Data Bus IO V20
ddr1_d17 EMIF1 Data Bus IO W20
ddr1_d18 EMIF1 Data Bus IO AB28
ddr1_d19 EMIF1 Data Bus IO AC28
ddr1_d20 EMIF1 Data Bus IO AC27
ddr1_d21 EMIF1 Data Bus IO Y19
ddr1_d22 EMIF1 Data Bus IO AB27
ddr1_d23 EMIF1 Data Bus IO Y20
ddr1_d24 EMIF1 Data Bus IO AA23
ddr1_d25 EMIF1 Data Bus IO Y22
ddr1_d26 EMIF1 Data Bus IO Y23
ddr1_d27 EMIF1 Data Bus IO AA24
ddr1_d28 EMIF1 Data Bus IO Y24
ddr1_d29 EMIF1 Data Bus IO AA26
ddr1_d30 EMIF1 Data Bus IO AA25
ddr1_d31 EMIF1 Data Bus IO AA28
ddr1_ecc_d0 EMIF1 ECC Data Bus IO W22
ddr1_ecc_d1 EMIF1 ECC Data Bus IO V23
ddr1_ecc_d2 EMIF1 ECC Data Bus IO W19
ddr1_ecc_d3 EMIF1 ECC Data Bus IO W23
ddr1_ecc_d4 EMIF1 ECC Data Bus IO Y25
ddr1_ecc_d5 EMIF1 ECC Data Bus IO V24
ddr1_ecc_d6 EMIF1 ECC Data Bus IO V25
ddr1_ecc_d7 EMIF1 ECC Data Bus IO Y26
ddr1_dqm0 EMIF1 Data Mask O AD23
ddr1_dqm1 EMIF1 Data Mask O AB23
ddr1_dqm2 EMIF1 Data Mask O AC26
ddr1_dqm3 EMIF1 Data Mask O AA27
ddr1_dqm_ecc EMIF1 ECC Data Mask O V26
ddr1_dqs0 Data strobe 0 input/output for byte 0 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO AH25
ddr1_dqsn0 Data strobe 0 invert IO AG25
ddr1_dqs1 Data strobe 1 input/output for byte 1 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO AE27
ddr1_dqsn1 Data strobe 1 invert IO AE28
ddr1_dqs2 Data strobe 2 input/output for byte 2 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO AD27
ddr1_dqsn2 Data strobe 2 invert IO AD28
ddr1_dqs3 Data strobe 3 input/output for byte 3 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO Y28
ddr1_dqsn3 Data strobe 3 invert IO Y27
ddr1_dqs_ecc EMIF1 ECC Data strobe input/output. This signal is output to the EMIF1 memory when writing and input when reading. IO V27
ddr1_dqsn_ecc EMIF1 ECC Complementary Data strobe IO V28
ddr1_vref0 Reference Power Supply EMIF1 A Y18
EMIF Channel 2
ddr2_csn0 EMIF2 Chip Select 0 O P24
ddr2_cke EMIF2 Clock Enable O U24
ddr2_ck EMIF2 Clock O T28
ddr2_nck EMIF2 Negative Clock O T27
ddr2_odt0 EMIF2 On-Die Termination for Chip Select 0 O R23
ddr2_casn EMIF2 Column Address Strobe O U28
ddr2_rasn EMIF2 Row Address Strobe O T23
ddr2_wen EMIF2 Write Enable O U25
ddr2_rst EMIF2 Reset output (DDR3-SDRAM only) O R24
ddr2_ba0 EMIF2 Bank Address O U23
ddr2_ba1 EMIF2 Bank Address O U27
ddr2_ba2 EMIF2 Bank Address O U26
ddr2_a0 EMIF2 Address Bus O R25
ddr2_a1 EMIF2 Address Bus O R26
ddr2_a2 EMIF2 Address Bus O R28
ddr2_a3 EMIF2 Address Bus O R27
ddr2_a4 EMIF2 Address Bus O P23
ddr2_a5 EMIF2 Address Bus O P22
ddr2_a6 EMIF2 Address Bus O P25
ddr2_a7 EMIF2 Address Bus O N20
ddr2_a8 EMIF2 Address Bus O P27
ddr2_a9 EMIF2 Address Bus O N27
ddr2_a10 EMIF2 Address Bus O N23
ddr2_a11 EMIF2 Address Bus O P26
ddr2_a12 EMIF2 Address Bus O N28
ddr2_a13 EMIF2 Address Bus O T22
ddr2_a14 EMIF2 Address Bus O R22
ddr2_a15 EMIF2 Address Bus O U22
ddr2_d0 EMIF2 Data Bus IO E26
ddr2_d1 EMIF2 Data Bus IO G25
ddr2_d2 EMIF2 Data Bus IO F25
ddr2_d3 EMIF2 Data Bus IO F24
ddr2_d4 EMIF2 Data Bus IO F26
ddr2_d5 EMIF2 Data Bus IO F27
ddr2_d6 EMIF2 Data Bus IO E27
ddr2_d7 EMIF2 Data Bus IO E28
ddr2_d8 EMIF2 Data Bus IO H23
ddr2_d9 EMIF2 Data Bus IO H25
ddr2_d10 EMIF2 Data Bus IO H24
ddr2_d11 EMIF2 Data Bus IO H26
ddr2_d12 EMIF2 Data Bus IO G26
ddr2_d13 EMIF2 Data Bus IO J25
ddr2_d14 EMIF2 Data Bus IO J26
ddr2_d15 EMIF2 Data Bus IO J24
ddr2_d16 EMIF2 Data Bus IO L22
ddr2_d17 EMIF2 Data Bus IO K20
ddr2_d18 EMIF2 Data Bus IO K21
ddr2_d19 EMIF2 Data Bus IO L23
ddr2_d20 EMIF2 Data Bus IO L24
ddr2_d21 EMIF2 Data Bus IO J23
ddr2_d22 EMIF2 Data Bus IO K22
ddr2_d23 EMIF2 Data Bus IO J20
ddr2_d24 EMIF2 Data Bus IO L27
ddr2_d25 EMIF2 Data Bus IO L26
ddr2_d26 EMIF2 Data Bus IO L25
ddr2_d27 EMIF2 Data Bus IO L28
ddr2_d28 EMIF2 Data Bus IO M23
ddr2_d29 EMIF2 Data Bus IO M24
ddr2_d30 EMIF2 Data Bus IO M25
ddr2_d31 EMIF2 Data Bus IO M26
ddr2_dqm0 EMIF2 Data Mask O F28
ddr2_dqm1 EMIF2 Data Mask O G24
ddr2_dqm2 EMIF2 Data Mask O K23
ddr2_dqm3 EMIF2 Data Mask O M22
ddr2_dqs0 Data strobe 0 input/output for byte 0 of the 32-bit data bus. This signal is output to the EMIF2 memory when writing and input when reading. IO G28
ddr2_dqsn0 Data strobe 0 invert IO G27
ddr2_dqs1 Data strobe 1 input/output for byte 1 of the 32-bit data bus. This signal is output to the EMIF2 memory when writing and input when reading. IO H27
ddr2_dqsn1 Data strobe 1 invert IO H28
ddr2_dqs2 Data strobe 2 input/output for byte 2 of the 32-bit data bus. This signal is output to the EMIF2 memory when writing and input when reading. IO K27
ddr2_dqsn2 Data strobe 2 invert IO K28
ddr2_dqs3 Data strobe 3 input/output for byte 3 of the 32-bit data bus. This signal is output to the EMIF2 memory when writing and input when reading. IO M28
ddr2_dqsn3 Data strobe 3 invert IO M27
ddr2_vref0 Reference Power Supply EMIF2 A N22

NOTE

The index numbers 1 and 2 which are part of the EMIF1 and EMIF2 signal prefixes (ddr1_* and ddr2_*) listed in Table 4-7, EMIF Signal Descriptions, not to be confused with DDR1 and DDR2 types of SDRAM memories.