JAJSGI1 November   2018 DLP4710

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      DLPDLP4710 0.47 1080pチップセット
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions – Connector Pins
    2.     Pin Functions – Test Pads
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Software Requirements
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Interface
      2. 8.3.2 Low-Speed Interface
      3. 8.3.3 High-Speed Interface
      4. 8.3.4 Timing
    4. 8.4 Device Functional Modes
    5. 8.5 Optical Interface and System Image Quality Considerations
      1. 8.5.1 Optical Interface and System Image Quality
        1. 8.5.1.1 Numerical Aperture and Stray Light Control
        2. 8.5.1.2 Pupil Match
        3. 8.5.1.3 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
    7. 8.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Power-Up Procedure
    2. 10.2 Power Supply Power-Down Procedure
    3. 10.3 Power Supply Sequencing Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デバイスの項目表記
      2. 12.1.2 デバイスのマーキング
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Design Requirements

A pico-projector is created by using a DLP chip set comprised of a DLP4710 DMD, two DLPC3439 or DLPC3479 controllers and a DLPA3000/DLPA3005 PMIC/LED driver. The DLPC3439 or DLPC3479 controllers do the digital image processing, the DLPA3000/DLPA3005 provides the needed analog functions for the projector, and the DLP4710 DMD is the display device for producing the projected image.

In addition to the three DLP chips in the chip set, other chips are needed. At a minimum a Flash part is needed to store the software and firmware to control each DLPC3439 or DLPC3479 controller.

The illumination light that is applied to the DMD is typically from red, green, and blue LEDs. These are often contained in three separate packages, but sometimes more than one color of LED die may be in the same package to reduce the overall size of the pico-projector.

For connecting the DLPC3439 or DLPC3479 controllers to the multimedia front end for receiving images, a 24-bit parallel interface is used. An I2C interface should be connected to the multimedia front end for sending commands to one of the DLPC3439 or DLPC3479 controllers for configuring the DLPC3439 or DLPC3479 controller for different features.