JAJSP83A October   2022  – March 2024 DLP781NE

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Timing Requirements
    9.     15
    10. 5.8  System Mounting Interface Loads
    11.     17
    12. 5.9  Micromirror Array Physical Characteristics
    13.     19
    14. 5.10 Micromirror Array Optical Characteristics
    15.     21
    16. 5.11 Window Characteristics
    17. 5.12 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Temperature Sensor Diode
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Requirements
    2. 8.2 DMD Power Supply Power-Up Procedure
    3. 8.3 DMD Power Supply Power-Down Procedure
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
      1. 9.2.1 Layers
      2. 9.2.2 Impedance Requirements
      3. 9.2.3 Trace Width, Spacing
        1. 9.2.3.1 Voltage Signals
  11. 10Device and Documentation Support
    1. 10.1 サード・パーティ製品に関する免責事項
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
    3. 10.3 Device Markings
    4. 10.4 Documentation Support
      1. 10.4.1 Related Documentation
    5. 10.5 ドキュメントの更新通知を受け取る方法
    6. 10.6 サポート・リソース
    7. 10.7 Trademarks
    8. 10.8 静電気放電に関する注意事項
    9. 10.9 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3 Temperature Sensor Diode

The DMD features a built-in thermal diode that measures the temperature at one corner of the die outside the micromirror array. The thermal diode can be interfaced with the TMP411 temperature sensor as shown in Figure 7-4. The software application contains functions to configure the TMP411 to read the DLP781NE DMD temperature sensor diode. This data can be leveraged by the customer to incorporate additional functionality in the overall system design such as adjusting illumination, fan speeds, and so on. All communication between the TMP411 and the DLPC4430 ディスプレイ コントローラ happens over the I2C interface. The TMP411 connects to the DMD through the pins outlined in Section 4.

Leave TEMP_N and TEMP_P pins unconnected (NC) if the temp sensor is not used.

GUID-20220829-SS0I-Q67Z-WLT4-FQGRG8GLXNT8-low.svg
A. Details omitted for clarity.
B. See the TMP411 data sheet for system board layout recommendation.
C. See the TMP411 data sheet and the TI reference design for suggested component values for R1, R2, R3, R4, and C1.
D. R5 = 0Ω. R6 = 0Ω. Place 0-Ω resistors close to the DMD package pins.
Figure 7-4 TMP411 Sample Schematic