JAJSBH2H October   2010  – August 2023 ISO1176T

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: ISODE-Pin
    10. 6.10 Electrical Characteristics: Driver
    11. 6.11 Electrical Characteristics: Receiver
    12. 6.12 Supply Current
    13. 6.13 Transformer Driver Characteristics
    14. 6.14 Switching Characteristics: Driver
    15. 6.15 Switching Characteristics: Receiver
    16. 6.16 Insulation Characteristics Curves
    17. 6.17 Typical Characteristics
  8. Parameter Measurement Information
    1.     27
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 Device I/O Schematics
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Voltages
          1. 9.2.2.1.1 39
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 用語集
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Switching Characteristics: Driver

All typical specs are at VCC1=3.3V, VCC2=5V, TA=27°C, (Min/Max specs are over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO1176
tPHL, tPLH Propagation delay VCC1 at 5 V, VCC2 at 5 V 23 35 ns
tsk(p)
Pulse skew (|tPHL – tPLH|)
 
VCC1 at 5 V, VCC2 at 5 V 2 7.5 ns
tPHL, tPLH Propagation delay VCC1 at 3.3 V, VCC2 at 5 V 40 ns
tsk(p)
Pulse skew (|tPHL – tPLH|)
 
VCC1 at 3.3 V, VCC2 at 5 V 2 7.5 ns
tr, tf Differential output rise time and fall time See Figure 17 2 3 7.5 ns
tpDE DE to ISODE prop delay See Figure 21 30 ns
tt(MLH), tt(MHL) Output transition skew See Figure 18 1 ns
tP(AZH), tP(BZH), tP(AZL), tP(BZL)
Propagation delay, high-impedance-to-active output
 
CL = 50 pF, RE at 0 V, See Fgure 19 and Figure 20 80 ns
tP(AHZ), tP(BHZ), tP(ALZ), tP(BLZ) Propagation delay time, active-to-high-impedance output CL = 50 pF, RE at 0 V, See Fgure 19 and Figure 20 80 ns
|tP(AZL) – tP(BZH)|, |tP(AZH) – tP(BZL)|
Enable skew time

CL = 50 pF, RE at 0 V, See Fgure 19 and Figure 20 0.55 1.5 ns

t(CFB)
 

Time from application of short-circuit to current foldback

See Figure 16 0.5 µs

t(TSD)
 

Time from application of short-circuit to thermal shutdown


TA = 25°C, See Figure 16
 
100 µs