SLLSG01B September   2024  – November 2025 ISO6440 , ISO6441 , ISO6442

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5V Supply
    10. 6.10 Supply Current Characteristics—5V Supply
    11. 6.11 Electrical Characteristics—3.3V Supply
    12. 6.12 Supply Current Characteristics—3.3V Supply
    13. 6.13 Electrical Characteristics—2.5V Supply 
    14. 6.14 Supply Current Characteristics—2.5V Supply
    15. 6.15 Switching Characteristics—5V Supply
    16. 6.16 Switching Characteristics—3.3V Supply
    17. 6.17 Switching Characteristics—2.5V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   27
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information
    1.     58
    2.     59
    3.     60

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBQ|16
  • DW|16
  • DFP|16
サーマルパッド・メカニカル・データ
発注情報

4 Device Comparison

Table 4-1 Device Comparison Table
DEVICE NAME TOTAL CHANNELS REVERSE CHANNELS DEFAULT OUTPUT PACKAGE CREEPAGE & CLEARANCE VDE RATING UL VISO CMTI
ISO6440DWR 4 0 HIGH Wide-SOIC (DW-16) >8.15mm Reinforced 5000VRMS ±200kV/μs minimum
ISO6440FDWR LOW
ISO6441DWR 1 HIGH
ISO6441FDWR LOW
ISO6442DWR 2 HIGH
ISO6442FDWR LOW
ISO6440DFPR 4 0 HIGH Wide-SSOP (DFP-16) >8mm Reinforced 5000VRMS ±200kV/μs minimum
ISO6440FDFPR LOW
ISO6441DFPR 1 HIGH
ISO6441FDFPR LOW
ISO6442DFPR 2 HIGH
ISO6442FDFPR LOW
ISO6440DBQR 4 0 HIGH SSOP (DBQ-16) >3.7mm Basic 3000VRMS ±100kV/μs minimum
ISO6440FDBQR LOW
ISO6441DBQR 1 HIGH
ISO6441FDBQR LOW
ISO6442DBQR 2 HIGH
ISO6442FDBQR LOW
ISO6440 ISO6441 ISO6442 Device Nomenclature Figure 4-1 Device Nomenclature