JAJSPW5B November 2023 – February 2024 LMKDB1108 , LMKDB1120
PRODMIX
THERMAL METRIC(1) | NPP (TLGA) | RKP (VQFN) | UNIT | |
---|---|---|---|---|
80 PINS | 40 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 33.1 | 33.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 31.9 | 24.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 16.2 | 13.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.5 | 0.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 16.0 | 13.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.8 | 4.2 | °C/W |