SNOSAY9G September   2008  – February 2016 LMP2021 , LMP2022

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions SC-70 and VSSOP references from LMP2021 pinout descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: 2.5 V
    6. 6.6 Electrical Characteristics: 5 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 EMI Suppression
      2. 7.4.2 Input Voltage Noise
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Achieving Lower Noise With Filtering
      2. 8.1.2 Input Bias Current
      3. 8.1.3 Lowering the Input Bias Current
      4. 8.1.4 Sensor Impedance
      5. 8.1.5 Transient Response to Fast Inputs
      6. 8.1.6 Digital Acquisition Systems
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

4 Revision History

Changes from F Revision (December 2014) to G Revision

  • Deleted SC-70 and VSSOP references from LMP2021 pinout descriptions Go
  • Deleted DCK and DGK packages and corrected SOT-23 pin function table for LMP2021 Go

Changes from E Revision (March 2013) to F Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from D Revision (March 2013) to E Revision

  • Changed layout of National Data Sheet to TI formatGo