JAJSI44 October   2019 LMR33610

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      効率と出力電流との関係 VOUT = 5V、400kHz
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Characteristics
    7. 8.7 System Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Good Flag Output
      2. 9.3.2 Enable and Start-up
      3. 9.3.3 Current Limit and Short Circuit
      4. 9.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Auto Mode
      2. 9.4.2 Dropout
      3. 9.4.3 Minimum Switch On-Time
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Custom Design With WEBENCH® Tools
        2. 10.2.2.2  Choosing the Switching Frequency
        3. 10.2.2.3  Setting the Output Voltage
        4. 10.2.2.4  Inductor Selection
        5. 10.2.2.5  Output Capacitor Selection
        6. 10.2.2.6  Input Capacitor Selection
        7. 10.2.2.7  CBOOT
        8. 10.2.2.8  VCC
        9. 10.2.2.9  CFF Selection
        10. 10.2.2.10 External UVLO
        11. 10.2.2.11 Maximum Ambient Temperature
      3. 10.2.3 Application Curves
    3. 10.3 What to Do and What Not to Do
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ground and Thermal Considerations
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 開発サポート
        1. 13.1.1.1 WEBENCH®ツールによるカスタム設計
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 サポート・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Pin Configuration and Functions

DDA Package
8-Pin HSOIC With PowerPAD™
Top View

Pin Functions

PIN TYPE DESCRIPTION
NO. NAME
1 PGND G Power ground terminal. Connect to system ground and AGND. Connect to bypass capacitor with short wide traces.
2 VIN P Input supply to regulator. Connect a high-quality bypass capacitor or capacitors directly to this pin and PGND.
3 EN A Enable input to regulator. High = ON, low = OFF. Can be connected directly to VIN; Do not float.
4 PG A Open drain power-good flag output. Connect to suitable voltage supply through a current limiting resistor. High = power OK, low = power bad. Flag pulls low when EN = Low. Can be left open when not used.
5 FB A Feedback input to regulator. Connect to tap point of feedback voltage divider. Do not float. Do not ground.
6 VCC P Internal 5-V LDO output. Used as supply to internal control circuits. Do not connect to external loads. Can be used as logic supply for power-good flag. Connect a high-quality 1-µF capacitor from this pin to GND.
7 BOOT P Boot-strap supply voltage for internal high-side driver. Connect a high-quality 100-nF capacitor from this pin to the SW pin. This simplifies the connection from the CBOOT capacitor to the SW pin.
8 SW P Regulator switch node. Connect to power inductor. This simplifies the connection from the CBOOT capacitor to the SW pin.
THERMAL
PAD 		AGND G Analog ground for regulator and system. Ground reference for internal references and logic. All electrical parameters are measured with respect to this pin. Connect to system ground on PCB. For the HSOIC package, the pad on the bottom of the device serves as both the AGND connection and a thermal connection to the heat sink ground plane. This pad must be soldered to a ground plane to achieve good electrical and thermal performance.
A = Analog, P = Power, G = Ground