To properly bypass the power supply, several locations on a printed-circuit board must be considered. A
6.8-µF or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is introduced onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V+ pin must be bypassed with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V+ and V– pins must be bypassed.
It is good practice to use a ground plane on a printed-circuit board to provide all components with a low inductive ground connection.
TI recommends surface-mount components in 0805 size or smaller in the LMV611-N application circuits. Designers can take advantage of the VSSOP miniature sizes to condense board layout to save space and reduce stray capacitance.