JAJSP96E April   2005  – October 2022 MAX3243E

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Driver Electrical Characteristics
    8. 7.8  Receiver, Electrical Characteristics
    9. 7.9  Auto-Powerdown Electrical Characteristics
    10. 7.10 Driver Switching Characteristics
    11. 7.11 Receiver Switching Characteristics
    12. 7.12 Auto-Powerdown Switching Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 ESD Protection
          1. 10.2.2.1.1 ESD Test Conditions
          2. 10.2.2.1.2 Human Body Model (HBM)
          3. 10.2.2.1.3 IEC61000-4-2 (Formerly Known as IEC1000-4-2)
          4. 10.2.2.1.4 Machine Model
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Example
        1.       Device and Documentation Support
          1. 11.1 Receiving Notification of Documentation Updates
          2. 11.2 サポート・リソース
          3. 11.3 Trademarks
          4. 11.4 Electrostatic Discharge Caution
          5. 11.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.