SLASE18A September   2015  – November 2015 RF430CL331H

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagrams
    2. 3.2 Pin Attributes
    3. 3.3 Signal Descriptions
    4. 3.4 Pin Multiplexing
    5. 3.5 Connections for Unused Pins
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Recommended Operating Conditions, Resonant Circuit
    5. 4.5 Supply Currents
    6. 4.6 Electrical Characteristics, Digital Inputs
    7. 4.7 Electrical Characteristics, Digital Outputs
    8. 4.8 Thermal Characteristics
    9. 4.9 Timing and Switching Characteristics
      1. 4.9.1 Reset Timing
      2. 4.9.2 Serial Communication Protocol Timing
      3. 4.9.3 RF143B NFC/RFID Analog Front End
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Terms and Acronyms
    4. 5.4  Serial Communication Interface
    5. 5.5  Communication Protocol
    6. 5.6  I2C Protocol
      1. 5.6.1 I2C Examples
        1. 5.6.1.1 I2C Write
        2. 5.6.1.2 I2C Read
      2. 5.6.2 BIP-8 Communication Mode With I2C
    7. 5.7  NFC Type 4B Tag Platform
      1. 5.7.1 ISO/IEC 14443-3 Commands
      2. 5.7.2 NFC Tag Type 4 Commands
      3. 5.7.3 Data Rate Settings
    8. 5.8  NDEF Structure
    9. 5.9  Typical Operation
      1. 5.9.1 NDEF or Capability Container Select Procedure
      2. 5.9.2 NDEF or Capability Container Read Binary Procedure
        1. 5.9.2.1 NDEF Read Command Internal Buffer Handling
        2. 5.9.2.2 NDEF Read Command Internal Buffer Handling (With Caching)
      3. 5.9.3 NDEF or Capability Container Read Procedure (Prefetch Feature)
        1. 5.9.3.1 NDEF Read Command With Prefetch Internal Buffer Handling
      4. 5.9.4 NDEF or Capability Container Write Procedure (Blocking)
        1. 5.9.4.1 NDEF Write Command (Blocking) Internal Buffer Handling
      5. 5.9.5 NDEF or Capability Container Write Procedure (Nonblocking)
        1. 5.9.5.1 NDEF Write Procedure (Nonblocking) Internal Buffer Handling
    10. 5.10 RF Command Response Timing Limits
    11. 5.11 Registers
      1. 5.11.1  General Control Register
      2. 5.11.2  Status Register
      3. 5.11.3  Interrupt Registers
      4. 5.11.4  CRC Registers
      5. 5.11.5  Communication Watchdog Register
      6. 5.11.6  Version Register
      7. 5.11.7  NDEF File Identifier Register
      8. 5.11.8  Host Response Register
      9. 5.11.9  NDEF Block Length Register
      10. 5.11.10 NDEF File Offset Register
      11. 5.11.11 Buffer Start Register
      12. 5.11.12 SWTX Register
      13. 5.11.13 Custom Status Word Response Register
    12. 5.12 Identification
      1. 5.12.1 Revision Identification
      2. 5.12.2 Device Identification
      3. 5.12.3 JTAG Identification
      4. 5.12.4 Software Identification
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Diagram
    2. 6.2 References
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Getting Started and Next Steps
      2. 7.1.2 Device and Development Tool Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Export Control Notice
    7. 7.7 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Device and Documentation Support

7.1 Device Support

7.1.1 Development Support

7.1.1.1 Getting Started and Next Steps

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the RF430CL331H device applications:

Software Development Tools: Code Composer Studio Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools.

Hardware Development Tools: For a complete listing of development-support tools for the RF430CL331H platform, visit the TI website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

7.1.2 Device and Development Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all RF430 MCU devices and support tools. Each commercial family member has one of three prefixes: RF, P, or X (for example, RF430FRL152H). TI recommends two of three possible prefix designators for its support tools: RF and X. These prefixes represent evolutionary stages of product development from engineering prototypes (with X for devices and tools) through fully qualified production devices and tools (with RF for devices tools).

Device development evolutionary flow:

X – Experimental device that is not necessarily representative of the electrical specifications of the final device

P – Silicon die that conforms to the electrical specifications of the final device but has not completed quality and reliability verification

RF – Fully qualified production device

Support tool development evolutionary flow:

X – Development-support product that has not yet completed TI's internal qualification testing.

RF – Fully-qualified development-support product

X and P devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

RF devices and RF development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X and P) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGE) and temperature range (for example, T). Figure 7-1 provides a legend for reading the complete device name for any family member.

RF430CL331H Part_Number_Decoder_SLASE18.gif Figure 7-1 Device Nomenclature

7.2 Documentation Support

7.2.1 Related Documentation

The following documents describe the RF430CL331H transponder. Copies of these documents are available on the Internet at www.ti.com.

    SLAZ672 RF430CL331H Device Erratasheet. Describes the known exceptions to the functional specifications for all silicon revisions of the device.

7.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded processors from TI and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.4 Trademarks

Code Composer Studio, E2E are trademarks of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

7.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.6 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.