JAJSS02H October 1993 – November 2023 SN65LBC175 , SN75LBC175
PRODUCTION DATA
THERMAL METRIC(1) | SOIC (D) | SOIC (DW) | PDIP (N) | UNIT | |
---|---|---|---|---|---|
16 Pins | 16 Pins | 16 Pins | |||
R θJA | Junction-to-ambient thermal resistance | 84.6 | 71.1 | 60.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | 37.4 | 48.1 | °C/W |
R θJB | Junction-to-board thermal resistance | 43.2 | 36.8 | 40.6 | °C/W |
ψ JT | Junction-to-top characterization parameter | 10.4 | 13.3 | 27.5 | °C/W |
ψ JB | Junction-to-board characterization parameter | 42.8 | 36.4 | 40.3 | °C/W |
R θJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |