JAJSC93E
June 2016 – December 2017
TAS2560
PRODUCTION DATA.
1
特長
2
アプリケーション
3
概要
4
改訂履歴
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
I2C Timing Requirements
7.7
I2S/LJF/RJF Timing in Master Mode
7.8
I2S/LJF/RJF Timing in Slave Mode
7.9
DSP Timing in Master Mode
7.10
DSP Timing in Slave Mode
7.11
PDM Timing
7.12
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
General I2C Operation
9.3.2
Single-Byte and Multiple-Byte Transfers
9.3.3
Single-Byte Write
9.3.4
Multiple-Byte Write and Incremental Multiple-Byte Write
9.3.5
Single-Byte Read
9.3.6
Multiple-Byte Read
9.3.7
PLL
9.3.8
Clock Distribution
9.3.9
Clock Error Detection
9.3.10
Class-D Edge Rate Control
9.3.11
IV Sense
9.3.12
Boost Control
9.3.13
Thermal Fold-back
9.3.14
Battery Guard AGC
9.3.15
Configurable Boost Current Limit (ILIM)
9.3.16
Fault Protection
9.3.16.1
Speaker Over-Current
9.3.16.2
Analog Under-Voltage
9.3.16.3
Die Over-Temperature
9.3.16.4
Clocking Faults
9.3.16.5
Brownout
9.3.17
Spread Spectrum vs Synchronized
9.3.18
IRQs and Flags
9.3.19
CRC checksum for I2C
9.3.20
PurePath Console 3 Software TAS2560 Application
9.4
Device Functional Modes
9.4.1
Audio Digital I/O Interface
9.4.1.1
I2S Mode
9.4.1.2
DSP Mode
9.4.1.3
DSP Time Slot Mode
9.4.1.4
Right-Justified Mode (RJF)
9.4.1.5
Left-Justified Mode (LJF)
9.4.1.6
Mono PCM Mode
9.4.1.7
Stereo Application Example - TDM Mode
9.4.2
PDM MODE
9.5
Operational Modes
9.5.1
Hardware Shutdown
9.5.2
Software Shutdown
9.5.3
Low Power Sleep
9.5.4
Software Reset
9.5.5
Device Processing Modes
9.5.5.1
Mode 1 - PCM input playback only
9.5.5.2
Mode 2 - PCM input playback + PCM IVsense output
9.5.5.3
Mode 2 96k
9.5.5.4
Mode 3 - PCM input playback + PDM IVsense output
9.5.5.5
Mode 4 - PDM input playback only
9.5.5.6
Mode 5 - PDM input playback + PDM IVsense output
9.6
Programming
9.6.1
Device Power Up and Un-mute Sequence 8Ω load
9.6.2
Device Power Up and Un-mute Sequence 4Ω or 6Ω load
9.6.3
Mute and Device Power Down Sequence
9.7
Register Map
9.7.1
Register Map Summary
9.7.1.1
Register Summary Table
9.7.2
PAGE (book=0x00 page=0x00 address=0x00) [reset=0h]
9.7.3
RESET (book=0x00 page=0x00 address=0x01) [reset=0h]
9.7.4
MODE (book=0x00 page=0x00 address=0x02) [reset=1h]
9.7.5
SPK_CTRL (book=0x00 page=0x00 address=0x04) [reset=5Fh]
9.7.6
PWR_CTRL_2 (book=0x00 page=0x00 address=0x05) [reset=0h]
9.7.7
PWR_CTRL_1 (book=0x00 page=0x00 address=0x07) [reset=0h]
9.7.8
RAMP_CTRL (book=0x00 page=0x00 address=0x08) [reset=1h]
9.7.9
EDGE_ISNS_BOOST (book=0x00 page=0x00 address=0x09) [reset=83h]
9.7.10
PLL_CLKIN (book=0x00 page=0x00 address=0x0F) [reset=41h]
9.7.11
PLL_JVAL (book=0x00 page=0x00 address=0x10) [reset=4h]
9.7.12
PLL_DVAL_1 (book=0x00 page=0x00 address=0x11) [reset=0h]
9.7.13
PLL_DVAL_2 (book=0x00 page=0x00 address=0x12) [reset=0h]
9.7.14
ASI_FORMAT (book=0x00 page=0x00 address=0x14) [reset=2h]
9.7.15
ASI_CHANNEL (book=0x00 page=0x00 address=0x15) [reset=0h]
9.7.16
ASI_OFFSET_1 (book=0x00 page=0x00 address=0x16) [reset=0h]
9.7.17
ASI_OFFSET_2 (book=0x00 page=0x00 address=0x17) [reset=0h]
9.7.18
ASI_CFG_1 (book=0x00 page=0x00 address=0x18) [reset=0h]
9.7.19
ASI_DIV_SRC (book=0x00 page=0x00 address=0x19) [reset=0h]
9.7.20
ASI_BDIV (book=0x00 page=0x00 address=0x1A) [reset=1h]
9.7.21
ASI_WDIV (book=0x00 page=0x00 address=0x1B) [reset=40h]
9.7.22
PDM_CFG (book=0x00 page=0x00 address=0x1C) [reset=0h]
9.7.23
PDM_DIV (book=0x00 page=0x00 address=0x1D) [reset=8h]
9.7.24
DSD_DIV (book=0x00 page=0x00 address=0x1E) [reset=8h]
9.7.25
CLK_ERR_1 (book=0x00 page=0x00 address=0x21) [reset=3h]
9.7.26
CLK_ERR_2 (book=0x00 page=0x00 address=0x22) [reset=3Fh]
9.7.27
IRQ_PIN_CFG (book=0x00 page=0x00 address=0x23) [reset=21h]
9.7.28
INT_CFG_1 (book=0x00 page=0x00 address=0x24) [reset=0h]
9.7.29
INT_CFG_2 (book=0x00 page=0x00 address=0x25) [reset=0h]
9.7.30
INT_DET_1 (book=0x00 page=0x00 address=0x26) [reset=0h]
9.7.31
INT_DET_2 (book=0x00 page=0x00 address=0x27) [reset=0h]
9.7.32
STATUS_POWER (book=0x00 page=0x00 address=0x2A) [reset=0h]
9.7.33
SAR_VBAT_MSB (book=0x00 page=0x00 address=0x2D) [reset=C0h]
9.7.34
SAR_VBAT_LSB (book=0x00 page=0x00 address=0x2E) [reset=0h]
9.7.35
DIE_TEMP_SENSOR (book=0x00 page=0x00 address=0x31) [reset=0h]
9.7.36
LOW_PWR_MODE (book=0x00 page=0x00 address=0x35) [reset=0h]
9.7.37
PCM_RATE (book=0x00 page=0x00 address=0x36) [reset=32h]
9.7.38
CLOCK_ERR_CFG_1 (book=0x00 page=0x00 address=0x4F) [reset=0h]
9.7.39
CLOCK_ERR_CFG_2 (book=0x00 page=0x00 address=0x50) [reset=11h]
9.7.40
PROTECTION_CFG_1 (book=0x00 page=0x00 address=0x58) [reset=3h]
9.7.41
CRC_CHECKSUM (book=0x00 page=0x00 address=0x7E) [reset=0h]
9.7.42
BOOK (book=0x00 page=0x00 address=0x7F) [reset=0h]
10
Application and Implementation
10.1
Application Information
10.2
Typical Applications
10.2.1
Design Requirements
10.2.1.1
Detailed Design Procedure
10.2.1.1.1
Mono/Stereo Configuration
10.2.1.1.2
Boost Converter Passive Devices
10.2.1.1.3
EMI Passive Devices
10.2.1.1.4
Miscellaneous Passive Devices
10.2.2
Application Performance Plots
10.3
Initialization Set Up
11
Power Supply Recommendations
11.1
Power Supplies
11.2
Power Supply Sequencing
11.2.1
Boost Supply Details
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
デバイスおよびドキュメントのサポート
13.1
ドキュメントのサポート
13.2
コミュニティ・リソース
13.3
商標
13.4
静電気放電に関する注意事項
13.5
Glossary
14
メカニカル、パッケージ、および注文情報
14.1
パッケージ寸法
パッケージ・オプション
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
メカニカル・データ(パッケージ|ピン)
YFF|30
サーマルパッド・メカニカル・データ
発注情報
jajsc93e_oa
jajsc93e_pm
12
Layout
12.1
Layout Guidelines
Place the boost inductor between VBAT and SW close to device terminals with no VIAS between the device terminals and the inductor.
Place the capacitor between VBOOST close to device terminals with no VIAS between the device terminals and capacitor.
Place the capacitor between VBOOST/VBAT and GND close to device terminals with no VIAS between the device terminals and capacitor.
Do not use VIAS for traces that carry high current. These include the traces for VBOOST, SW, VBAT, PGND and the speaker SPK_P, SPK_M.
Use epoxy filled vias for the interior pads.
Connect VSENSE_P, VSENSE_N as close as possible to the speaker.
VSENSE_P, VSENSE_N should be connected between the EMI ferrite and the speaker if EMI ferrites are used on SPK_P, SPK_M.
EMI ferrites must be used if EMI capacitors are used on SPK_P, SPK_M.
Use a ground plane with multiple vias for each terminal to create a low-impedance connection to GND for minimum ground noise.
Use supply decoupling capacitors as shown in
Figure 98
and described in
Power Supplies
.
Place EMI ferrites, if used, close to the device.
12.2
Layout Example
Figure 101.
TAS2560 Board Layout