SCPS242D December   2012  – July 2017 TCA9517

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 I2C Interface Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Two-Channel Bidirectional Buffer
      2. 9.3.2 Active-High Repeater-Enable Input
      3. 9.3.3 VOL B-Side Offset Voltage
      4. 9.3.4 Standard Mode and Fast Mode Support
      5. 9.3.5 Clock Stretching Support
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Clock Stretching Support
        2. 10.2.2.2 VILC and Pullup Resistor Sizing
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Community Resource
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCCB Supply voltage range –0.5 7 V
VCCA Supply voltage range –0.5 7 V
VI Enable input voltage range(2) –0.5 7 V
VI/O I2C bus voltage range(2) –0.5 7 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±5500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine model (A115-A) ±200
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN MAX UNIT
VCCA Supply voltage, A-side bus 0.9(2) 5.5 V
VCCB Supply voltage, B-side bus 2.7 5.5 V
VIH High-level input voltage SDAA, SCLA 0.7 × VCCA 5.5 V
SDAB, SCLB 0.7 × VCCB 5.5
EN 0.7 × VCCB 5.5
VIL Low-level input voltage SDAA, SCLA 0.3 × VCCA V
SDAB, SCLB(1) 0.3 × VCCB
EN 0.3 × VCCB
IOL Low-level output current 6 mA
TA Operating free-air temperature –40 85 °C
(1) VIL specification is for the first low level seen by the SDAB and SCLB lines. VILc is for the second and subsequent low levels seen by the SDAB and SCLB lines. See VILC and Pullup Resistor Sizing for VILC application information
(2) Low-level supply voltage

7.4 Thermal Information

THERMAL METRIC(1) TCA9517 UNIT
DGK (VSSOP) D (SOIC)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 187.6 133.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.3 87.6 °C/W
RθJB Junction-to-board thermal resistance 108.6 74.2 °C/W
ψJT Junction-to-top characterization parameter 3.4 36.9 °C/W
ψJB Junction-to-board characterization parameter 106.9 73.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

VCCB = 2.7 V to 5.5 V, GND = 0 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS VCCB MIN TYP MAX UNIT
VIK Input clamp voltage II = –18 mA 2.7 V to 5.5 V –1.2 V
VOL Low-level output voltage SDAB, SCLB IOL = 100 μA or 6 mA,
VILA = VILB = 0 V		 2.7 V to 5.5 V 0.45 0.52 0.6 V
SDAA, SCLA IOL = 6 mA 0.1 0.2
VOL – VILc Low-level input voltage below low-level output voltage SDAB, SCLB ensured by design 2.7 V to 5.5 V 70 mV
VILC SDA and SCL low-level input voltage contention SDAB, SCLB 2.7 V to 5.5 V 0.4 V
ICC Quiescent supply current for VCCA Both channels low,
SDAA = SCLA = GND and
SDAB = SCLB = open, or
SDAA = SCLA = open and
SDAB = SCLB = GND		 1 mA
ICC Quiescent supply current Both channels high,
SDAA = SCLA = VCCA and
SDAB = SCLB = VCCB and
EN = VCCB 		5.5 V 1.5 5 mA
Both channels low,
SDAA = SCLA = GND and
SDAB = SCLB = open		 1.5 5
In contention,
SDAA = SCLA = GND and
SDAB = SCLB = GND		 3 5
II Input leakage current SDAB, SCLB VI = VCCB 2.7 V to 5.5 V ±1 μA
VI = 0.2 V 10
SDAA, SCLA VI = VCCB ±1
VI = 0.2 V 10
EN VI = VCCB ±1
VI = 0.2 V –10 –30
IOH High-level output leakage current SDAB, SCLB VO = 3.6 V 2.7 V to 5.5 V 10 μA
SDAA, SCLA 10
CI Input capacitance EN VI = 3 V or 0 V 3.3 V 6 10 pF
SCLA, SCLB VI = 3 V or 0 V 3.3 V 8 13
0 V 7 11
CIO Input/output capacitance SDAA, SDAB VI = 3 V or 0 V 3.3 V 8 13 pF
0 V 7 11

7.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
tsu Setup time, EN high before Start condition(1) 100 ns
th Hold time, EN high after Stop condition(1) 100 ns
(1) EN should change state only when the global bus and the repeater port are in an idle state.

7.7 I2C Interface Switching Characteristics

VCCB = 2.7 V to 5.5 V, GND = 0 V, TA = –40°C to 85°C (unless otherwise noted)(1) (4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP(5) MAX UNIT
tPLZ Propagation delay SDAB, SCLB(3) (see Figure 6) SDAA, SCLA(3) (see Figure 6) 80 141 250 ns
SDAA, SCLA(2) (see Figure 5) SDAB, SCLB(2) (see Figure 5) 25 74 110
tPZL Propagation delay SDAB, SCLB SDAA, SCLA VCCA ≤ 2.7 V (see Figure 4) 30 76(6) 110 ns
VCCA ≥ 3 V
(see Figure 4)		 10 86 230
SDAA, SCLA(2) (see Figure 5) SDAB, SCLB(2) (see Figure 5) 60 107 230
tTLH Transition time B-side to A side 80% 20% VCCA ≤ 2.7 V
(see Figure 5)		 10 12 15 ns
VCCA ≥ 3 V
(see Figure 5)		 40 42 45
A side to B-side
(see Figure 4)		 110 125 140
tTHL Transition time B-side to A side 80% 20% VCCA ≤ 2.7 V
(see Figure 5)		 1 52(6) 105 ns
VCCA ≥ 3 V
(see Figure 5)		 20 67 175
A side to B-side
(see Figure 4)		 30 48 90
(1) Times are specified with loads of 1.35-kΩ pull-up resistance and 50-pF load capacitance on the B-side and 167-Ω pull-up and 57-pF load capacitance on the A side. Different load resistance and capacitance alter the RC time constant, thereby changing the propagation delay and transition times.
(2) The proportional delay data from A to B-side is measured at 0.3 VCCA on the A side to 1.5 V on the B-side.
(3) The tPLH delay data from B to A side is measured at 0.4 V on the B-side to 0.5 VCCA on the A side when VCCA is less than 2 V, and 1.5 V on the A side if VCCA is greater than 2 V.
(4) pull-up voltages are VCCA on the A side and VCCB on the B-side.
(5) Typical values were measured with VCCA = VCCB = 3.3 V at TA = 25°C, unless otherwise noted.
(6) Typical value measured with VCCA = 2.7 V at TA = 25°C

7.8 Typical Characteristics

VCCA = 0.9 V, VCCB = 2.7 V
TCA9517 D001_TCA9517A_SCPS245.gif Figure 1. Port A VOL vs IOL
TCA9517 D002_TCA9517A_SCPS245.gif Figure 2. Port B VOL vs IOL