JAJSKM6 november   2020 TLV6700-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Inputs (INA+, INB–)
      2. 8.3.2 Outputs (OUTA, OUTB)
      3. 8.3.3 Window Comparator
      4. 8.3.4 Immunity to Input Terminal Voltage Transients
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > UVLO)
      2. 8.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 8.4.3 Power-On Reset (VDD < V(POR))
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 VPULLUP to a Voltage Other Than VDD
      2. 9.1.2 Monitoring VDD
      3. 9.1.3 Monitoring a Voltage Other Than VDD
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resistor Divider Selection
        2. 9.2.2.2 Pullup Resistor Selection
        3. 9.2.2.3 Input Supply Capacitor
        4. 9.2.2.4 Input Capacitors
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) DDC
(SOT)		 DSE (WSON) UNIT
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 204.6 194.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.5 128.9 °C/W
RθJB Junction-to-board thermal resistance 54.3 153.8 °C/W
ψJT Junction-to-top characterization parameter 0.8 11.9 °C/W
ψJB Junction-to-board characterization parameter 52.8 157.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.