JAJSI23I September   2009  – October 2019 TMP431 , TMP432

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      代表的なアプリケーション回路図
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
      2. 8.3.2 Beta Compensation
      3. 8.3.3 Series Resistance Cancellation
      4. 8.3.4 Differential Input Capacitance
      5. 8.3.5 Filtering
      6. 8.3.6 Sensor Fault
      7. 8.3.7 THERM and ALERT/THERM2
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
      2. 8.4.2 One-Shot Mode
    5. 8.5 Programming
      1. 8.5.1  Serial Interface
      2. 8.5.2  Bus Overview
      3. 8.5.3  Timing Diagrams
      4. 8.5.4  Serial Bus Address
      5. 8.5.5  Read and Write Operations
      6. 8.5.6  Undervoltage Lockout
      7. 8.5.7  Timeout Function
      8. 8.5.8  High-Speed Mode
      9. 8.5.9  General Call Reset
      10. 8.5.10 SMBus Alert Function
    6. 8.6 Register Maps
      1. 8.6.1  Pointer Register
      2. 8.6.2  Temperature Registers
      3. 8.6.3  Limit Registers
      4. 8.6.4  Status Registers
        1. 8.6.4.1 TMP431 Status Register
        2. 8.6.4.2 TMP432 Status Register
      5. 8.6.5  Configuration Register 1
      6. 8.6.6  Configuration Register 2
      7. 8.6.7  Conversion Rate Register
      8. 8.6.8  Beta Compensation Configuration Register
      9. 8.6.9  η-Factor Correction Register
      10. 8.6.10 Software Reset
      11. 8.6.11 Consecutive Alert Register
      12. 8.6.12 Therm Hysteresis Register
      13. 8.6.13 Identification Registers
      14. 8.6.14 Open Status Register
      15. 8.6.15 Channel Mask Register
      16. 8.6.16 High Limit Status Register
      17. 8.6.17 Low Limit Status Register
      18. 8.6.18 THERM Limit Status Register
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 関連リンク
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Detailed Design Procedure

The temperature measurement accuracy of the TMP43x depends on the remote and local temperature sensor being at the same temperature as the system point being monitored. Clearly, if the temperature sensor is not in good thermal contact with the part of the system being monitored, then there will be a delay in the response of the sensor to a temperature change in the system. For remote temperature sensing applications that use a substrate transistor (or a small, SOT23 transistor) placed close to the device being monitored, this delay is usually not a concern.

The local temperature sensor inside the TMP43x monitors the ambient air around the device. The thermal time constant for the TMP43x is approximately 2 s. This constant implies that if the ambient air changes quickly by 100°C, it would take the TMP43x about 10 seconds (that is, five thermal time constants) to settle to within 1°C of the final value. In most applications, the TMP43x package is in thermal contact with the printed circuit board (PCB), as well as subjected to forced airflow. The accuracy of the measured temperature directly depends on how accurately the PCB and forced airflow temperatures represent the temperature that the TMP43x is measuring. Additionally, the internal power dissipation of the TMP43x can cause the temperature to rise above the ambient or PCB temperature. The internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the small currents used. For a 5.5-V supply and maximum conversion rate of eight conversions per second, the TMP43x dissipate 1.82 mW (PDIQ = 5.5 V × 330 μA). If both the ALERT/THERM2 and THERM pins are each sinking 1 mA, an additional 0.8 mW is dissipated (PDOUT = 1 mA × 0.4 V + 1 mA × 0.4 V = 0.8 mW). Total power dissipation is then 2.62 mW (PDIQ + PDOUT) and, with an θJA of 150°C/W, causes the junction temperature to rise approximately 0.393°C above the ambient.