JAJSE10A May   2017  – May 2018 TPL7407LA

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      単純なアプリケーションの回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Inductive Load Drive
      2. 8.4.2 Resistive Load Drive
      3. 8.4.3 ON State Input Current
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Unipolar Stepper Motor Driver
      2. 9.1.2 Multi-Purpose Sink Driver
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 TTL and other Logic Inputs
        2. 9.2.2.2 Input RC Snubber
        3. 9.2.2.3 High-Impedance Input Drivers
        4. 9.2.2.4 Drive Current
        5. 9.2.2.5 Output Low Voltage
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Improving Package Thermal Performance
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.3 Thermal Considerations

The number of coils driven is dependent on the coil current and on-chip power dissipation. The number of coils driven can be determined by Figure 3 or Figure 4.

For a more accurate determination of number of coils possible, use Equation 3 to calculate TPL7407LA on-chip power dissipation PD:

Equation 3. TPL7407LA eq1_lrs059.gif

where

  • N is the number of channels active together
  • VOLi is the OUTi pin voltage for the load current ILi. This is the same as VCE(SAT)

In order to guarantee reliability of TPL7407LA and the system, the on-chip power dissipation must be lower than or equal to the maximum allowable power dissipation (PD(MAX)) dictated by below equation Equation 4.

Equation 4. TPL7407LA eq2_lrs059.gif

where

  • TJ(MAX) is the target maximum junction temperature
  • TA is the operating ambient temperature
  • θJA is the package junction to ambient thermal resistance

It is recommended to limit rhe TPL7407LA IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation.