SLUS930D April   2011  – November  2016 TPS40400

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Setting
      2. 7.3.2 Input Voltage Feedforward
      3. 7.3.3 Output Current Limit and Warning
      4. 7.3.4 Linear Regulators
      5. 7.3.5 PMBus Address
      6. 7.3.6 PMBus Connections
      7. 7.3.7 PMBus Functionality and Additional Set-Up
        1. 7.3.7.1  Data Format
        2. 7.3.7.2  Output Voltage Adjustment
        3. 7.3.7.3  Overcurrent Threshold
        4. 7.3.7.4  Output Current Reading
        5. 7.3.7.5  Soft-Start Time
        6. 7.3.7.6  Power Good
        7. 7.3.7.7  Undervoltage Lockout (UVLO)
        8. 7.3.7.8  Output Overvoltage and Undervoltage Thresholds
        9. 7.3.7.9  Programmable Fault Responses
        10. 7.3.7.10 User Data and Adjustable Anti-Cross-Conduction Delay
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
      2. 7.4.2 Operation with CNTL Signal Control
      3. 7.4.3 Operation with OPERATION Control
      4. 7.4.4 Operation with CNTL and OPERATION Control
      5. 7.4.5 Operation without CNTL or OPERATION Control
      6. 7.4.6 Operation with Output Trim and Margin
    5. 7.5 Programming
      1. 7.5.1 Supported PMBus Commands
    6. 7.6 Register Maps
      1. 7.6.1  OPERATION (01h)
        1. 7.6.1.1 On
        2. 7.6.1.2 Margin
      2. 7.6.2  ON_OFF_CONFIG (02h)
        1. 7.6.2.1 Pu
        2. 7.6.2.2 Cmd
        3. 7.6.2.3 Cpr
        4. 7.6.2.4 Pol
        5. 7.6.2.5 Cpa
      3. 7.6.3  CLEAR_FAULTS (03h)
      4. 7.6.4  WRITE_PROTECT (10h)
      5. 7.6.5  STORE_DEFAULT_ALL (11h)
      6. 7.6.6  RESTORE_DEFAULT_ALL (12h)
      7. 7.6.7  STORE_DEFAULT_CODE (13h)
      8. 7.6.8  RESTORE_DEFAULT_CODE (14h)
      9. 7.6.9  VOUT_MODE (20h)
        1. 7.6.9.1 Mode
        2. 7.6.9.2 Exponent
      10. 7.6.10 VOUT_TRIM (22h)
      11. 7.6.11 VOUT_MARGIN_HIGH (25h)
      12. 7.6.12 VOUT_MARGIN_LOW (26h)
      13. 7.6.13 VOUT_SCALE_LOOP (29h)
        1. 7.6.13.1 Exponent
        2. 7.6.13.2 Mantissa
      14. 7.6.14 FREQUENCY_SWITCH (33h)
        1. 7.6.14.1 Exponent
        2. 7.6.14.2 Mantissa
      15. 7.6.15 VIN_ON (35h)
        1. 7.6.15.1 Exponent
        2. 7.6.15.2 Mantissa
      16. 7.6.16 VIN_OFF (36h)
        1. 7.6.16.1 Exponent
        2. 7.6.16.2 Mantissa
      17. 7.6.17 IOUT_CAL_GAIN (38h)
        1. 7.6.17.1 Exponent
        2. 7.6.17.2 Mantissa
      18. 7.6.18 IOUT_CAL_OFFSET (39h)
        1. 7.6.18.1 Exponent
        2. 7.6.18.2 Mantissa
      19. 7.6.19 VOUT_OV_FAULT_LIMIT (40h)
      20. 7.6.20 VOUT_OV_FAULT_RESPONSE (41h)
        1. 7.6.20.1 RSP[1:0]
        2. 7.6.20.2 RS[2:0]
      21. 7.6.21 VOUT_UV_FAULT_LIMIT (44h)
      22. 7.6.22 VOUT_UV_FAULT_RESPONSE (45h)
        1. 7.6.22.1 RSP[1:0]
        2. 7.6.22.2 RS[2:0]
      23. 7.6.23 IOUT_OC_FAULT_LIMIT (46h)
        1. 7.6.23.1 Exponent
        2. 7.6.23.2 Mantissa
      24. 7.6.24 IOUT_OC_FAULT_RESPONSE (47h)
        1. 7.6.24.1 RSP[1:0]
        2. 7.6.24.2 RS[2:0]
      25. 7.6.25 IOUT_OC_WARN_LIMIT (4Ah)
        1. 7.6.25.1 Exponent
        2. 7.6.25.2 Mantissa
      26. 7.6.26 OT_FAULT_RESPONSE (50h)
        1. 7.6.26.1 OTF_RS
      27. 7.6.27 POWER_GOOD_ON (5Eh)
      28. 7.6.28 POWER_GOOD_OFF (5Fh)
      29. 7.6.29 TON_RISE (61h)
        1. 7.6.29.1 Exponent
        2. 7.6.29.2 Mantissa
      30. 7.6.30 STATUS_BYTE (78h)
      31. 7.6.31 STATUS_WORD (78h)
      32. 7.6.32 STATUS_VOUT (7Ah)
      33. 7.6.33 STATUS_IOUT (7Bh)
      34. 7.6.34 STATUS_TEMPERATURE (7Dh)
      35. 7.6.35 STATUS_CML (7Eh)
      36. 7.6.36 READ_VIN (88h)
        1. 7.6.36.1 Exponent
        2. 7.6.36.2 Mantissa
      37. 7.6.37 READ_VOUT (8Bh)
        1. 7.6.37.1 Exponent
        2. 7.6.37.2 Mantissa
      38. 7.6.38 READ_IOUT (8Ch)
        1. 7.6.38.1 Exponent
        2. 7.6.38.2 Mantissa
      39. 7.6.39 PMBUS_REVISION (98h)
      40. 7.6.40 MFR_VIN_MIN (A0h)
        1. 7.6.40.1 Exponent
        2. 7.6.40.2 Mantissa
      41. 7.6.41 MFR_VIN_MAX (A1h)
        1. 7.6.41.1 Exponent
        2. 7.6.41.2 Mantissa
      42. 7.6.42 MFR_VOUT_MIN (A4h)
        1. 7.6.42.1 Exponent
        2. 7.6.42.2 Mantissa
      43. 7.6.43 MFR_VOUT_MAX (A5h)
        1. 7.6.43.1 Exponent
        2. 7.6.43.2 Mantissa
      44. 7.6.44 MFR_SPECIFIC_00 (D0h)
        1. 7.6.44.1 Dead-Time Control Setting (DTC)
        2. 7.6.44.2 WPE
      45. 7.6.45 MFR_SPECIFIC_01 (D1h)
      46. 7.6.46 MFR_SPECIFIC_02 (D2h)
      47. 7.6.47 MFR_SPECIFIC_03 (D3h)
      48. 7.6.48 MFR_SPECIFIC_04 (D4h)
      49. 7.6.49 MFR_SPECIFIC_05 (D5h)
      50. 7.6.50 MFR_SPECIFIC_06 (D6h)
      51. 7.6.51 MFR_SPECIFIC_07 (D7h)
      52. 7.6.52 MFR_SPECIFIC_44 (FCh)
        1. 7.6.52.1 Identifier Code
        2. 7.6.52.2 Revision Code
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS40400 12-V Input, 1.2-V Output, 20-A (maximum) Output Current ConverterAdded Design Example 1
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Design Example List of Materials
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Selecting a Switching Frequency
          2. 8.2.1.2.2  Output Inductor, LOUT
          3. 8.2.1.2.3  Output Capacitance, COUT
          4. 8.2.1.2.4  The Resistive Component of Output Ripple
          5. 8.2.1.2.5  Peak Current Rating of the Inductor
          6. 8.2.1.2.6  Input Capacitance, CIN
          7. 8.2.1.2.7  Switching MOSFETs, QHS and QLS
          8. 8.2.1.2.8  Device Addressing, RADDR0 and RADDR1
          9. 8.2.1.2.9  Current Sense Flter, R16 and C17
          10. 8.2.1.2.10 Voltage Decoupling Capacitors, CBP3, CBP6, and CVDD
          11. 8.2.1.2.11 Bootstrap Capacitor, C9
          12. 8.2.1.2.12 Snubber R12 and C16
          13. 8.2.1.2.13 Loop Compensaton Components
          14. 8.2.1.2.14 Output Voltage Set Point, RBIAS
          15. 8.2.1.2.15 Remote Sensing
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TPS40400 12-V Input 5-V Output, 5-A (Maximum) Output Current Converter Design Example 2Added Design Example 2
        1. 8.2.2.1 Design Requirements
          1. 8.2.2.1.1 List of Materials
        2. 8.2.2.2 Application Curves
    3. 8.3 Initialization Setup
      1. 8.3.1 Internal Configuration
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Specifications

Absolute Maximum Ratings(1)

MIN MAX UNIT
Input voltage VDD –0.3 22 V
SW –5 27
BOOT –0.3 30
BOOT-SW, HDRV-SW (Differential from BOOT or HDRV to SW) –0.3 7
VSNS+, TRACK, SYNC, FB –0.3 7
DATA, CLK, CNTL –0.3 3.6
ISNS+, ISNS– –0.3 15
VSNS– –0.3 0.3
Output voltage HDRV –0.3 30 V
BP3 –0.3 3.8
BP6, COMP, PGOOD, DIFFO, LDRV –0.3 7
SMBALRT, ADDR0, ADDR1 –0.3 3.6
Operating junction temperature, TJ –40 150 °C
Storage Temperature, Tstg –55 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD Controller input voltage 3 20 V
TJ Operating junction temperature –40 125 °C

Thermal Information

THERMAL METRIC(1) TPS40400 UNIT
RHL (VQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 31.1 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

Electrical Characteristics

Unless otherwise stated, these specifications apply for –40°C ≤ TJ ≤ 125°C, VDD= 12 Vdc, FREQUENCY_SWITCH = 600 kHz
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT SUPPLY
VVDD Input voltage range 3 20 V
IVDD Input operating current Switching, no driver load 6 15 mA
VOLTAGE REFERENCE
VFB Feedback pin voltage default settings 594 600 606 mV
VFB(max) Feedback pin voltage maximum adjustment 750 mV
VFB(min) Feedback pin voltage minimum adjustment 450 mV
VFB(inc) Feedback pin voltage adjustment resolution 2.34 mV
VFB(NL) Maximum nonlinearity error over adjustment range 10 mV
BP6 REGULATOR
VBP6 6-V regulator output voltage 6.2 6.5 6.8 V
VDO6 Regulator dropout voltage, (VVDD – VBP6) VVDD = 6 V, IBP6 = 50 mA 300 mV
IBP6 Regulator current limit 100 mA
BP3 REGULATOR
VBP3 3.3-V regulator output voltage 3.1 3.3 3.5 V
VDO3 Regulator dropout voltage, (VVDD – VBP3) VVDD = 3 V, IBP3 = 5 mA 100 200 mV
OSCILLATOR
fSW Switching frequency Factory default setting 480 600 720 kHz
Nominal frequency range 200 2000
Accuracy 3 V ≤ VVDD ≤ 20 V, 200 kHz ≤ fSW ≤ 2 MHz –20% 20%
VIH SYNC high-level input voltage 2 V
VIL SYNC low-level input voltage 0.4
ISYNC SYNC pin leakage current VSYNC = 6 V 100 nA
VSYNC = 0 V 100
tSRISE Maximum SYNC rise time(1) 100 ns
tSYNC Minimum SYNC pulse width 100 ns
VRMP Ramp amplitude(1) FREQUENCY_SWITCH = 200 kHz VVDD/6.6 VVDD/6.5 VVDD/6.3 V
FREQUENCY_SWITCH = 600 kHz VVDD/7.0 VVDD/6.8 VVDD/6.6
FREQUENCY_SWITCH = 2000 kHz VVDD/10 VVDD/9.6 VVDD/9.2
VVLY Valley voltage(1) 0.9
fSYNC SYNC range % of nominal oscillator frequency 200 kHz ≤ fSW ≤ 2 MHz 85% 150%
PULSE WIDTH MODULATOR (PWM)
DMAX Maximum duty cycle(1) (9) FREQUENCY_SWITCH = 600 kHz 90%
FREQUENCY_SWITCH = 1.2 MHz 85%
FREQUENCY_SWITCH = 2 MHz 75%
tOFF(min) Minimum OFF time 170 225 ns
tON(min) Minimum controllable pulse(1) TJ = 25°C, fSW = 600 kHz 75 ns
SOFT-START
tSS Soft-start time(6) Factory default setting 2.7 3.1 3.5 ms
Accuracy 600 μs ≤ tSS ≤ 9 ms –15% 15%
ERROR AMPLIFIER
GBWP Gain bandwidth product(1) 15 20 MHz
AOL DC gain(1) 60 dB
IIBFB Input bias current: FB (out of pin) 0 100 nA
IIBT Input bias current: TRACK (out of pin) 0 250 nA
IEAOP Output source current VFB = 0 V, VCOMP ≥ 2 V 1 mA
IEAOM Output sink current VFB = 2 V, VCOMP ≤ 0.3 V 1
VCOMPH Error amplifier high output voltage VFB = 0 V 3.8 V
VCOMPL Error amplifier low output voltage VFB = 2 V 50 mV
VTRACK(ofst) TRACK pin offset voltage –5 5 mV
CURRENT SENSE AMPLIFIER
IISNS+ ISNS+ bias current 200 nA
IISNS– ISNS– bias current 100 μA
VICM Input common-mode range 0.45 15 V
AOCM Common-mode gain –80 dB
VLIN Input linear range, VISNS+ - VISNS-(2) –45 110 mV
CURRENT LIMIT PROTECTION
tOFF Off time between restart attempts 6 × tSS ms
VILIMTH VCS+ – VCS– voltage that trips OC fault function Factory default settings(2), TJ = 25°C 27 30 33 mV
Threshold accuracy 3 V ≤ VVDD ≤ 20 V,
30 mV ≤ VILIMTH ≤ 110 mV, TJ = 25°C
–10% 10%
3V ≤ VVDD ≤ 20 V, VILIMTH ≤ 30 mV,
TJ = 25°C
–3 3 mV
Comparator offset VILIMTH = 30 mV, TJ = 25°C –3 3 mV
Temperature coefficient(1) 4000 ppm/°C
tDLYOC Overcurrent delay 3-mV overdrive, TJ = 25°C 155 ns
VILIMW VCS+ – VCS– voltage that sets warning status Factory default settings, TJ = 25°C 12 15 18 mV
Threshold accuracy 3 V ≤ VVDD ≤ 20V,
1.9 mV ≤ VILIMTH ≤ 120 mV, TJ = 25°C
–10% 10%
3V ≤ VVDD ≤ 20 V, VILIMTH < 30 mV,
TJ = 25°C
–3 3 mV
Comparator offset VILIMTH = 20 mV, TJ = 25°C –3 3 mV
Temperature coefficient(1) 4000 ppm/°C
tDLYOCW Overcurrent warning delay(1) 3-mV overdrive 250 ns
BOOTSTRAP
VBOOT Internal diode voltage drop IBOOT = 5 mA 0.7 1 V
IBOOT(lk) BOOT diode leakage current(1) (VBOOT – VSW) = 6 V 1 μA
UVLO
VUVLO(on) VDD UVLO turn on threshold(7) Factory default settings (minimum) 2.475 2.75 3.025 V
Accuracy(7) 2.25 V ≤ VVDD ≤ 20 V,
2.75 V ≤ VIN_ON ≤ 18 V
–10% 10%
VUVLO(off) VDD UVLO turnoff threshold(7) Factory default settings (minimum) 2.25 2.5 2.75 V
Accuracy(7) 2.25 V < VVDD < 20 V,
2.75 V < VIN_OFF < 17.6 V
–10% 10%
REMOTE VOLTAGE SENSE AMPLIFIER
VIOFST Input offset voltage –10 10 mV
RGAIN Gain-setting resistor(1) 48 60 72
VDIFFO Output voltage at DIFFO pin VVDD > 6.5 V 0 6 V
VVDD = 5 V 0 4.5
VVDD = 3 V 0 2.5
KDIFF Differential gain of amplifier 0.995 1 1.005 V/V
VAGBWP Closed-loop bandwidth(1) 2 MHz
IVAOP Output source current VSNS+ = VDIFFO = 5 V, VSNS– = 0 V 1 mA
IVAOM Output sink current VSNS+ = 0 V, VSNS– = 4.5 V, VDIFFO = 5 V 1 mA
POWERGOOD
VPGON FB pin voltage upper limit for power good on Factory default settings 648 mV
FB pin voltage lower limit for power good on 552
Accuracy 540 mV < VPGON < 660 mV –5% 5%
VPGOFF FB pin voltage upper limit for power good off Factory default settings 660 mV
FB pin voltage lower limit for power good off 540
Accuracy 528 mV < VPGOFF < 672 mV –5% 5%
RPGD Pulldown resistance of PGD pin VFB = 0, IPGOOD = 5 mA 50 Ω
IPGDLK Leakage current Factory default settings ,
550 mV < VFB < 650 mV, VPGOOD = 5 V
3 15 μA
tPGD Delay filter from FB(1) 5 μs
OUTPUT VOLTAGE MARGINING
MRGSLP VFB slope during margin voltage transition(1) Factory default settings 250 214 188 V/s
Accuracy 3 V < VVDD < 20 V, 600 μs < tSS < 9 ms –15% 15%
VFBMH FB pin voltage after margin high command Factory default settings 650 660 670 mV
VFBML FB pin voltage after margin low command Factory default settings 532 540 548 mV
VFBM(max) Maximum FB pin voltage with margin 742 750 758 mV
VFBM(min) Minimum FB pin voltage with margin 445 450 455 mV
VFB(inc) Resolution of FB steps with margin 2.34 mV
OVERVOLTAGE AND UNDERVOLTAGE DETECTION
VOV FB pin overvoltage threshold (OV flag) Factory default settings 638 672 705 mV
Accuracy 3 V < VVDD < 20 V, 648 mV < VOV < 690 mV –5% 5%
VUV FB pin undervoltage threshold (UV flag) Factory default settings 502 528 554 mV
Accuracy 3 V < VVDD < 20 V,
510 mV < VOV < 552 mV
–5% 5%
PMBus INTERFACE
VIH High-level input voltage, CLK, DATA, CNTL 2.1 V
VIL Low-level input voltage, CLK, DATA, CNTL 0.8 V
IIH High-level input current, CLK, DATA, CNTL –10 10 μA
CNTL –12 10
IIL Low-level input current, CLK, DATA, CNTL –10 10 μA
CNTL –12 10
VOL Low-level output voltage, DATA, SMBALRT 3 V ≤ VVDD ≤ 20 V, IOUT = 2 mA 0.4 V
IOH High-level open-drain leakage current, DATA, SMBALRT VOUT = 3.6 V 0 10 μA
CO (1) Pin capacitance, CLK, DATA 0.7 pF
fPMB PMBus operating frequency range Slave mode 10 400 kHz
PMBus ADDRESSING
IADD ADDX pin current 8.23 9.75 11.21 μA
VADD(L) Address pin illegal low voltage threshold 0.055 V
MEASUREMENT SYSTEM
tIDLY Read delay time(3) 153 192 231 μs
IRES Current measurement resolution (LSB)(10)(5) 122 μV
IRNG Current measurement range(5) (4) –45 110 mV
IACC Gain accuracy(8) –3% 3%
IOFST Offset –3 3 mV
VOUT(res) VOUT measurement resolution (LSB) 15.625 mV
VOUT(rng) VOUT voltage measurement range 0 14 V
VOUT(gain) Gain accuracy(8)(1) –2 2 LSB
VOUT(gain_adj) Gain adjustment range through PMBus –10% 10%
VOUT(ofst) Offset(8)(1) –3% 3%
VOUT(ofst_adj) Gain adjustment range through PMBus –125 124 mV
VIN(res) VIN measurement resolution 32.5 mV
VIN(rng) VIN voltage measurement range 3 20 V
VIN(gain) Gain accuracy(8)(1) –2% 2%
VIN(gain_adj) Gain adjustment range through PMBus –10% 10%
VIN(offst) Offset(8)(1) –5.5 –2 1.4 LSB
VIN(offst_adj) Offset adjustment range through PMBus –2 1.968 V
THERMAL SHUTDOWN
TJSD Junction OT shutdown temperature(1) 135 145 155 °C
TJSDH Shutdown hysteresis(1) 25 30 35 °C
TJWRN Junction OT warning threshold(1) 120 130 140 °C
TJWRNH Junction OT warning temperature hysteresis(1) 15 20 25 °C
Specified by design. Not production tested.
The entire current ripple waveform must remain within the linear range for current reading results to be accurate. DC current level must be zero or greater for accurate results. Current sense does not support applications that sink current. Transient voltages (such as ripple) are permitted to fall below 0 V, but must be within the specified linear range.
All read backs are an average of 16 consecutive measurements – not a rolling average. Time is a delay between parameter updates.
Current reading is only supported to 0 average. Voltage transients to –45 mV are taken into account when computing this average.
Voltage is converted to current by dividing by IOUT_CAL_GAIN, the effective value of the resistance used to sense current in the application. Maximum amount that can be reported through PMBus is 64 A.
See Application and Implementation section for more information regarding soft-start time setting.
Although specifications appear to overlap, hysteresis is assured for UVLO turnon and turnoff thresholds.
PMBus commands provide for calibration of each device on an individual basis for improved overall system accuracy.
Operation at 3 V reduces maximum duty cycle by approximately 5%.
Constrained by the resolution of READ_IOUT command. This presents as the greater of 122 µV/ IOUT_CAL_GAIN or 62.5 mA, the resolution of the READ_IOUT command

Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RHDHI High-side driver pullup resistance (VBOOT – VSW) = 6.4 V,
IHDRV = –100 mA, TJ = 25°C
1.25 2.5 Ω
RHDLO High-side driver pulldown resistance (VBOOT – VSW) = 6.4 V,
IHDRV = 100 mA, TJ = 25°C
1.3 2.6 Ω
RLDHI Low-side driver pullup resistance TJ = 25°C 1.25 2.5 Ω
RLDLO Low-side driver pulldown resistance TJ = 25°C 0.8 1.5 Ω
tHRISE High-side driver rise time(1) CLOAD = 2.2 nF 6 12.1 ns
tHFALL High-side driver fall time(1) CLOAD = 2.2 nF 6.3 12.6 ns
tLRISE Low-side driver rise time(1) CLOAD = 2.2 nF 6 12.1 ns
tLFALL Low-side driver fall time(1) CLOAD = 2.2 nF 4 8 ns
tDT Anti-cross conduction time MFR_SPECIFIC_00 bit 0 = 0,
(short dead time.)
20 50 ns
ISW SW pin leakage current (out of pin) VSW = 0 V 1 µA
Specified by Design. Not production tested.

Dissipation Ratings(1)

PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT
(°C/W)
AIRFLOW TA = 25°C
POWER RATING
(W)
TA = 85°C
POWER RATING
(W)
24-Pin Plastic
QFN (RHL)
31.1 Natural Convection 3.21 1.29
25.2 200 LFM 3.96 1.58
23 400 LFM 4.36 1.74
Ratings based on JEDEC High Thermal Conductivity (High K) Board. For more information on the test method, see TI Technical Brief SZZA017.

Typical Characteristics

TPS40400 vfbref_v_t_lus930.png Figure 1. FB Pin Voltage Reference Variation
vs Junction Temperature
TPS40400 deadtime_v_t_lus930.png Figure 3. Dead Time
vs. Junction Temperature
TPS40400 diffgain_v_t_slu930.png Figure 5. Remote Voltage Amplifier Gain
vs Junction Temperature
TPS40400 vtrackbias_v_t_lus930.png Figure 7. TRACK Pin Input Bias Current
vs Junction Temperature
TPS40400 eaiout_v_t_lus930.png Figure 9. Error Amplifier Output Current
vs Junction Temperature
TPS40400 lsdvrrdson_v_t_lus930.png Figure 11. Low-Side Driver Resistance
vs Junction Temperature
TPS40400 deltafsw12_v_t_slu930.png Figure 13. Switching Frequency Change
vs Junction Temperature
TPS40400 pgleak_v_t_lus930.png Figure 15. PGOOD Pin Current Leakage
vs Junction Temperature
TPS40400 cnrtlhyst_v_t_lus930.png Figure 2. CRTL Pin Hysteresis
vs Junction Temperature
TPS40400 rvao12_v_t_slu930.png Figure 4. Remote Voltage Amplifier Offset
vs Junction Temperature
TPS40400 vtrackoffset_v_t_lus930.png Figure 6. TRACK Pin Offset Voltage
vs Junction Temperature
TPS40400 fbbias_v_t_lus930.png Figure 8. FB pin Input Bias Current
vs Junction Temperature
TPS40400 hsdvrrdson_v_t_lus930.png Figure 10. High-Side Driver Resistance
vs Junction Temperature
TPS40400 minton_v_t_lus930.png Figure 12. Minimum ON-Time
vs Junction Temperature
TPS40400 deltafsw3_v_t_slu930.png Figure 14. Switching Frequency Change
vs Junction Temperature
TPS40400 pgr2gnd_v_t_lus930.png Figure 16. PGOOD Resistance to GND
vs Junction Temperature