JAJSEU4D December   2015  – December 2019 TPS4H160-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      代表的なアプリケーションの回路図
      2.      可変電流制限による容量性負荷の駆動
  4. 改訂履歴
  5. 概要(続き)
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Pin Current and Voltage Conventions
      2. 9.3.2 Accurate Current Sense
      3. 9.3.3 Adjustable Current Limit
      4. 9.3.4 Inductive-Load Switching-Off Clamp
      5. 9.3.5 Fault Detection and Reporting
        1. 9.3.5.1 Diagnostic Enable Function
        2. 9.3.5.2 Multiplexing of Current Sense
        3. 9.3.5.3 Fault Table
        4. 9.3.5.4 STx and FAULT Reporting
      6. 9.3.6 Full Diagnostics
        1. 9.3.6.1 Short-to-GND and Overload Detection
        2. 9.3.6.2 Open-Load Detection
          1. 9.3.6.2.1 Channel On
          2. 9.3.6.2.2 Channel Off
        3. 9.3.6.3 Short-to-Battery Detection
        4. 9.3.6.4 Reverse Polarity Detection
        5. 9.3.6.5 Thermal Fault Detection
          1. 9.3.6.5.1 Thermal Shutdown
      7. 9.3.7 Full Protections
        1. 9.3.7.1 UVLO Protection
        2. 9.3.7.2 Loss-of-GND Protection
        3. 9.3.7.3 Protection for Loss of Power Supply
        4. 9.3.7.4 Reverse-Current Protection
        5. 9.3.7.5 MCU I/O Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Working Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 Without a GND Network
      2. 12.2.2 With a GND Network
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントの更新通知を受け取る方法
    2. 13.2 コミュニティ・リソース
    3. 13.3 商標
    4. 13.4 静電気放電に関する注意事項
    5. 13.5 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1) TPS4H160-Q1 UNIT
PWP (HTSSOP)
28 PINS
RθJA Junction-to-ambient thermal resistance 32.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.1 °C/W
RθJB Junction-to-board thermal resistance 14.4 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 14.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.1 °C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.