JAJSHA3K December   2012  – May 2019 TPS50301-HT

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      効率と負荷電流との関係:VIN = 5V
  4. 改訂履歴
  5. 概要(続き)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 8.3.2  PVIN vs Frequency
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Adjusting the Output Voltage
      5. 8.3.5  Maximum Duty Cycle Limit
      6. 8.3.6  PVIN vs Frequency
      7. 8.3.7  Safe Start-Up into Prebiased Outputs
      8. 8.3.8  Error Amplifier
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Enable and Adjust UVLO
      11. 8.3.11 Adjustable Switching Frequency and Synchronization (SYNC)
      12. 8.3.12 Slow Start (SS/TR)
      13. 8.3.13 Power Good (PWRGD)
      14. 8.3.14 Bootstrap Voltage (BOOT) and Low Dropout Operation
      15. 8.3.15 Sequencing (SS/TR)
      16. 8.3.16 Output Overvoltage Protection (OVP)
      17. 8.3.17 Overcurrent Protection
        1. 8.3.17.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.17.2 Low-Side MOSFET Overcurrent Protection
      18. 8.3.18 TPS50301-HT Thermal Shutdown
      19. 8.3.19 Turn-On Behavior
      20. 8.3.20 Small Signal Model for Loop Response
      21. 8.3.21 Simple Small Signal Model for Peak Current Mode Control
      22. 8.3.22 Small Signal Model for Frequency Compensation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fixed-Frequency PWM Control
      2. 8.4.2 Continuous Current Mode (CCM) Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Operating Frequency
        3. 9.2.2.3  Output Inductor Selection
        4. 9.2.2.4  Output Capacitor Selection
        5. 9.2.2.5  Input Capacitor Selection
        6. 9.2.2.6  Slow Start Capacitor Selection
        7. 9.2.2.7  Bootstrap Capacitor Selection
        8. 9.2.2.8  Undervoltage Lockout (UVLO) Set Point
        9. 9.2.2.9  Output Voltage Feedback Resistor Selection
          1. 9.2.2.9.1 Minimum Output Voltage
        10. 9.2.2.10 Compensation Component Selection
      3. 9.2.3 Parallel Operation
      4. 9.2.4 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 WEBENCH®ツールによるカスタム設計
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報
    1. 13.1 デバイスの項目表記

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Overview

The device is a 6.3-V, 3-A, synchronous step-down (buck) converter with two integrated N-channel MOSFETs. To improve performance during line and load transients, the device implements a constant frequency, peak current mode control, which also simplifies external frequency compensation. The wide switching frequency, 100 kHz to 1 MHz, allows for efficiency and size optimization when selecting the output filter components.

The device is designed for safe monotonic startup into prebiased loads. The default start up is when VIN is typically 3 V. The EN pin has an internal pullup current source that can be used to adjust the input voltage UVLO with two external resistors. In addition, the EN pin can be floating for the device to operate with the internal pullup current. The total operating current for the device is approximately 5 mA when not switching and under no load. When the device is disabled, the supply current is typically less than 2.5 mA.

The integrated MOSFETs allow for high-efficiency power supply designs with continuous output currents up to 3 A. The MOSFETs have been sized to optimize efficiency for lower duty cycle applications.

The device reduces the external component count by integrating the boot recharge circuit. The bias voltage for the integrated high-side MOSFET is supplied by a capacitor between the BOOT and PH pins. The boot capacitor voltage is monitored by a BOOT to PH UVLO (BOOT-PH UVLO) circuit allowing the PH pin to be pulled low to recharge the boot capacitor. The device can operate over duty cycle range per Equation 2 and Equation 3 as long as the boot capacitor voltage is higher than the preset BOOT-PH UVLO threshold, which is typically 2.2 V. The output voltage can be stepped down to as low as the 0.795-V voltage reference (Vref).

The device has a power good comparator (PWRGD) with hysteresis which monitors the output voltage through the VSENSE pin. The PWRGD pin is an open-drain MOSFET which is pulled low when the VSENSE pin voltage is less than 91% or greater than 109% of the reference voltage Vref and asserts high when the VSENSE pin voltage is 94% to 106% of the Vref.

The SS/TR (slow start/tracking) pin is used to minimize inrush currents or provide power-supply sequencing during power-up. A small-value capacitor or resistor divider should be coupled to the pin for slow start or critical power-supply sequencing requirements.

The device is protected from output overvoltage, overload, and thermal fault conditions. The device minimizes excessive output overvoltage transients by taking advantage of the overvoltage circuit power good comparator. When the overvoltage comparator is activated, the high-side MOSFET is turned off and prevented from turning on until the VSENSE pin voltage is lower than 106% of the Vref. The device implements both high-side MOSFET overload protection and bidirectional low-side MOSFET overload protections, which help control the inductor current and avoid current runaway. The device also shuts down if the junction temperature is higher than thermal shutdown trip point. The device is restarted under control of the slow-start circuit automatically when the junction temperature drops 10°C typical below the thermal shutdown trip point.