JAJSJP3A September   2020  – October 2020 TPS51397A

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and DCAP3 Control
      2. 7.3.2 Soft Start
      3. 7.3.3 Large Duty Operation
      4. 7.3.4 Power Good
      5. 7.3.5 Overcurrent Protection and Undervoltage Protection
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 UVLO Protection
      8. 7.3.8 Output Voltage Discharge
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Operation
      2. 7.4.2 Advanced Eco-mode Control
      3. 7.4.3 Out-of-Audio
      4. 7.4.4 Mode Selection
      5. 7.4.5 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Output Voltage Set Point
          2. 8.2.2.1.2 MODE Selection
          3. 8.2.2.1.3 Inductor Selection
          4. 8.2.2.1.4 Output Capacitor Selection
          5. 8.2.2.1.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TPS51397AUNIT
RJE (VQFN)
20 PINS
RθJAJunction-to-ambient thermal resistance49.7°C/W
RθJA_effectiveJunction-to-ambient thermal resistance (4-layer custom board)(2)39.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance26.2°C/W
RθJBJunction-to-board thermal resistance14.4°C/W
ψJTJunction-to-top characterization parameter0.9°C/W
ψJBJunction-to-board characterization parameter14.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance13.0°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2) 70 mm x 70 mm, 4 layers, thickness: 1.5 mm. 2 oz. copper traces located on the top and bottom of the PCB. 4 thermal vias in the PowerPAD area under the device package.