JAJSI66A November   2019  – March 2020 TPS7A54

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      デジタル負荷の電源
      2.      RFコンポーネントの電源
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Voltage Regulation Features
        1. 8.3.1.1 DC Regulation
        2. 8.3.1.2 AC and Transient Response
      2. 8.3.2 System Start-Up Features
        1. 8.3.2.1 Programmable Soft Start (NR/SS Pin)
        2. 8.3.2.2 Internal Sequencing
          1. 8.3.2.2.1 Enable (EN)
          2. 8.3.2.2.2 Undervoltage Lockout (UVLO) Control
          3. 8.3.2.2.3 Active Discharge
        3. 8.3.2.3 Power-Good Output (PG)
      3. 8.3.3 Internal Protection Features
        1. 8.3.3.1 Foldback Current Limit (ICL)
        2. 8.3.3.2 Thermal Protection (Tsd)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Regulation
      2. 8.4.2 Disabled
      3. 8.4.3 Current Limit Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Recommended Capacitor Types
        1. 9.1.1.1 Input and Output Capacitor Requirements (CIN and COUT)
        2. 9.1.1.2 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
        3. 9.1.1.3 Feed-Forward Capacitor (CFF)
      2. 9.1.2  Soft Start and Inrush Current
      3. 9.1.3  Optimizing Noise and PSRR
      4. 9.1.4  Charge Pump Noise
      5. 9.1.5  Current Sharing
      6. 9.1.6  Adjustable Operation
      7. 9.1.7  Power-Good Operation
      8. 9.1.8  Undervoltage Lockout (UVLO) Operation
      9. 9.1.9  Dropout Voltage (VDO)
      10. 9.1.10 Device Behavior During Transition From Dropout Into Regulation
      11. 9.1.11 Load Transient Response
      12. 9.1.12 Reverse Current Protection Considerations
      13. 9.1.13 Power Dissipation (PD)
      14. 9.1.14 Estimating Junction Temperature
      15. 9.1.15 TPS7A54EVM Thermal Analysis
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Layout
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 評価基板
        2. 12.1.1.2 SPICEモデル
      2. 12.1.2 デバイスの項目表記
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.1.15 TPS7A54EVM Thermal Analysis

The TPS7A54EVM is used to develop the TPS7A5401RPS thermal model. The RPS package is a 2.2-mm × 2.5-mm, 12-pin VQFN with 25-µm plating on each via. The EVM is a 3-inch × 3-inch (7.62 mm × 7.62 mm) PCB comprised of four layers. Table 6 lists the layer stackup for the EVM. Figure 48 to Figure 52 illustrate the various layer details for the EVM.

Table 6. Stackup

LAYER NAME MATERIAL THICKNESS (mil)
1 Top overlay — —
2 Top solder Solder resist 0.4
3 Top layer Copper 1.4
4 Dielectric 1 FR-4 high Tg 18.5
5 Mid layer 1 Copper 1.4
6 Dielectric 2 FR-4 high Tg 18.6
7 Mid layer 2 Copper 1.4
8 Dielectric 3 FR-4 high Tg 18.5
9 Bottom layer Copper 1.4
10 Bottom solder Solder resist 0.4
Figure 48. Top Composite View
Figure 50. Mid Layer 1 Routing
Figure 52. Bottom Layer Routing
Figure 49. Top Layer Routing
Figure 51. Mid Layer 2 Routing

Figure 53 shows the thermal gradient on the PCB that results when a 1-W power dissipation is used through the PassFET with a 25°C ambient temperature.

TPS7A54 sbvs311_thermal-gradient.gifFigure 53. PCB Thermal Gradient

For additional information on the PCB, see the TPS7A54EVM user guide.