JAJSMS4F August   2021  – March 2024 TPS7H2211-SEP , TPS7H2211-SP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Options
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: All Devices
    6. 7.6  Electrical Characteristics: CFP and KGD Options
    7. 7.7  Electrical Characteristics: HTSSOP Option
    8. 7.8  Switching Characteristics: All Devices
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Overvoltage Protection
      2. 9.3.2 Current Limit
      3. 9.3.3 Soft Start (Adjustable Rise Time)
      4. 9.3.4 Parallel Operation
      5. 9.3.5 Reverse Current Protection
      6. 9.3.6 Forward Leakage Current
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Application 1: Cold Sparing
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Capacitance
          2. 10.2.1.2.2 Enable Control
          3. 10.2.1.2.3 Overvoltage Protection
          4. 10.2.1.2.4 Soft Start Time
          5. 10.2.1.2.5 Summary
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Application 2: Protection
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Capacitance
          2. 10.2.2.2.2 Enable Control
          3. 10.2.2.2.3 Overvoltage Protection
          4. 10.2.2.2.4 Soft Start Time
          5. 10.2.2.2.5 Summary
        3. 10.2.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DAP|32
  • KGD|0
  • HKR|16
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

HKR Package DAP Package
16-Pin CFP With Thermal Pad 32-Pin HTSSOP With Thermal Pad
Top View Top View
GUID-099BF11F-374E-4E2B-9E13-0C95307A150C-low.png GUID-20230213-SS0I-25WZ-DJJP-54Z39X534WLQ-low.svg
Table 6-1 Pin Functions
PIN I/O(1) DESCRIPTION
HKR (16) NO. PW(32) NO. NAME
1-4 1-10 VIN I Switch input. An input bypass capacitor is recommended for minimizing VIN dip.
6 12 EN I Active high switch control input. Do not float this pin.
7 13 OVP I Overvoltage protection. Set using an external resistor divider. If no OVP is desired, connect this pin to GND. Do not float this pin.
8 15 GND — Device ground. (2)
12 22 SS I/O Soft start (switch slew rate control). If this functionality is not desired, the SS pin must be left disconnected (floating). In all cases be sure to follow the requirements of Section 9.3.3.
13-16 23-32 VOUT O Switch output. A minimum 10-µF output capacitor is recommended.
5, 9-11 11,14,16,17-21 NC — NC — No connect. These pins are not internally connected. It is recommended to connect these pins to GND to prevent charge buildup; however, these pins can also be left open or tied to any voltage between GND and VIN.
— Thermal Pad — Thermal pad (exposed center pad) for heat dissipation purposes. The thermal pad is internally connected to the seal ring and GND.
— Metal Lid — The lid is internally connected to the thermal pad and GND through the seal ring.
  1. I = Input, O = Output, I/O = Input or Output, — = Other
  2. Thermal pad is internally connected to the seal ring and GND for HKR option.
Table 6-2 Bare Die Information
DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS
15 mils Silicon with backgrind Ground AlCu 1050 nm
GUID-20210331-CA0I-GXPW-8M17-V59HJXL0R6HD-low.png
  1. All dimensions in microns (μm).
  2. The inner rectangle is the die and the outer rectangle is the die plus scribe lines.
Table 6-3 Bond Pad Coordinates in Microns (μm)
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
VIN 1 653.22 4936.95 793.17 5076.9
VIN 2 152.37 4936.95 292.32 5076.9
VIN 3 319.32 4936.95 459.27 5076.9
VIN 4 486.27 4936.95 626.22 5076.9
VIN 5 152.37 4770 292.32 4909.95
VIN 6 319.32 4770 459.27 4909.95
VIN 7 486.27 4770 626.22 4909.95
VIN 8 653.22 4770 793.17 4909.95
VIN 9 152.37 4579.16 292.32 4719.11
VIN 10 319.32 4579.16 459.27 4719.11
VIN 11 486.27 4579.16 626.22 4719.11
VIN 12 653.22 4579.16 793.17 4719.11
VIN 13 152.37 4412.21 292.32 4552.16
VIN 14 319.32 4412.21 459.27 4552.16
VIN 15 486.27 4412.21 626.22 4552.16
VIN 16 653.22 4412.21 793.17 4552.16
VIN 17 152.37 3553.11 292.32 3693.06
VIN 18 319.32 3553.11 459.27 3693.06
VIN 19 486.27 3553.11 626.22 3693.06
VIN 20 653.22 3553.11 793.17 3693.06
VIN 21 152.37 3386.16 292.32 3526.11
VIN 22 319.32 3386.16 459.27 3526.11
VIN 23 486.27 3386.16 626.22 3526.11
VIN 24 653.22 3386.16 793.17 3526.11
VINA(1) 25 54.99 1823.09 194.94 1963.04
VINA(1) 26 54.99 1652.54 194.94 1792.49
NC 27 54.99 1480.77 194.94 1620.72
NC 28 54.99 1238.72 194.94 1378.67
EN 29 54.99 972.68 194.94 1112.63
NC 30 54.99 581.31 194.94 721.26
OVP 31 54.99 406.26 194.94 546.21
GND 32 407.21 54.99 547.16 194.94
GND 33 577.76 54.99 717.71 194.94
NC 34 2792.88 54.99 2932.83 194.94
NC 35 3315.06 587.43 3455.01 727.38
NC 36 3315.06 1099.26 3455.01 1239.21
SS 37 3315.06 1544.09 3455.01 1684.04
VOUT 38 3217.64 3386.16 3357.59 3526.11
VOUT 39 3050.69 3386.16 3190.64 3526.11
VOUT 40 2883.74 3386.16 3023.69 3526.11
VOUT 41 2716.79 3386.16 2856.74 3526.11
VOUT 42 3217.64 3553.11 3357.59 3693.06
VOUT 43 3050.69 3553.11 3190.64 3693.06
VOUT 44 2883.74 3553.11 3023.69 3693.06
VOUT 45 2716.79 3553.11 2856.74 3693.06
VOUT 46 3217.64 4412.21 3357.59 4552.16
VOUT 47 3050.69 4412.21 3190.64 4552.16
VOUT 48 2883.74 4412.21 3023.69 4552.16
VOUT 49 2716.79 4412.21 2856.74 4552.16
VOUT 50 3217.64 4579.16 3357.59 4719.11
VOUT 51 3050.69 4579.16 3190.64 4719.11
VOUT 52 2883.74 4579.16 3023.69 4719.11
VOUT 53 2716.79 4579.16 2856.74 4719.11
VOUT 54 3217.64 4770 3357.59 4909.95
VOUT 55 3050.69 4770 3190.64 4909.95
VOUT 56 2883.74 4770 3023.69 4909.95
VOUT 57 2716.79 4770 2856.74 4909.95
VOUT 58 3217.64 4936.95 3357.59 5076.9
VOUT 59 3050.69 4936.95 3190.64 5076.9
VOUT 60 2883.74 4936.95 3023.69 5076.9
VOUT 61 2716.79 4936.95 2856.74 5076.9
(1) VINA supplies internal circuitry. Connect VINA to VIN in a single point manner.