JAJSES0 February   2018 XTR305

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーション
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output Mode
    6. 6.6  Electrical Characteristics: Current Output Mode
    7. 6.7  Electrical Characteristics: Operational Amplifier (OPA)
    8. 6.8  Electrical Characteristics: Instrumentation Amplifier (IA)
    9. 6.9  Electrical Characteristics: Current Monitor
    10. 6.10 Electrical Characteristics: Power and Digital
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Functional Features
      2. 7.3.2 Current Monitor
      3. 7.3.3 Error Flags
      4. 7.3.4 Power On/Off Glitch
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Voltage Output Mode
        2. 8.2.2.2  Current Output Mode
        3. 8.2.2.3  Input Signal Connection
        4. 8.2.2.4  Externally-Configured Mode: OPA and IA
        5. 8.2.2.5  Driver Output Disable
        6. 8.2.2.6  Driving Capacitive Loads and Loop Compensation
        7. 8.2.2.7  Internal Current Sources, Switching Noise, and Settling Time
        8. 8.2.2.8  IA Structure, Voltage Monitor
        9. 8.2.2.9  Digital I/O and Ground Considerations
        10. 8.2.2.10 Output Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 VQFN Package and Heat Sinking
    4. 10.4 Power Dissipation
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) XTR305 UNIT
RGW (VQFN)
20 PINS
RθJA Junction-to-ambient thermal resistance 38 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.2 °C/W
RθJB Junction-to-board thermal resistance 12.5 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 16.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.